Reflow furnace smoke removing method

Abstract

The invention discloses a reflow furnace smoke removing method and relates to the technical field of electronic equipment soldering. The reflow furnace smoke removing method comprises the steps that S1, the surface of a printed circuit board to be soldered is coated with soldering paste, the soldering paste coating printed circuit board is put into a reflow furnace, the printed circuit board put into the reflow furnace enters a preheating area, water in the soldering paste is evaporated, soldering flux is used for wetting a component pin and a bonding pad, and the soldering paste begins to soften and cover the bonding pad so that the component pin and the bonding pad are isolated from the oxygen; and S2, then the printed circuit board enters a reflow area. According to the reflow furnace smoke removing method, the smoke removing effect is greatly enhanced, smoke solidified crystals are prevented from depositing on fan blades, great centralized cooling and filtering treatment is carriedout on reflow gas with soldering flux smoke in the reflow furnace, the purpose of guaranteeing that the printed circuit board carries out soldering work well is achieved well, and therefore a manufacturing enterprise of the printed circuit board is completely facilitated.

Description

Technical field [0001] The present invention relates to the technical field of soldering of electronic devices, in particular to a method for removing smoke from a reflow oven. Background technique [0002] The solder paste is used for soldering in the reflow furnace. The solder paste is first applied to the soldering part of the printed circuit board with a printing device and a dispenser, and electronic components are mounted on the applied part. The soldering of the printed circuit board and electronic components is performed by heating the printed circuit board on which the electronic components are mounted in the reflow furnace, melting the solder paste, and the reflow furnace for soldering the printed circuit board is composed of a preliminary heating zone, a main heating zone, and a cooling zone. The printed circuit board coated with solder paste is pre-heated by the heater in the preliminary heating zone, and is mainly heated by the heater in the main heating zone, and co...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a method for removing smoke from the reflow furnace, which solves the problem that the existing removal methods have poor removal effects, and there are still smoke solidified crystals deposited on the fan blades, which cannot realize the removal of smoke in the reflow furnace. The reflow gas with flux fume is well concentrated cooling and filtering treatment, which cannot achieve the purpose of ensuring the good soldering work of the printed circuit board