Gas-liquid two-phase mixed jet micro-channel heat sink

Abstract

The invention provides a gas-liquid two-phase mixed jet micro-channel heat sink. The heat sink comprises an upper cover plate, a gas-liquid mixed jet structure, a micro-channel plate, a heater and a base, wherein the gas-liquid two-phase mixed jet structure comprises a cooling liquid inlet, a cross-flow liquid inlet, a jet entry cavity, jet holes and a gas-liquid mixed flow outlet. Cooling liquidfirst flows in from the cooling liquid inlet, a part flows to the micro-channel plate through the cross-flow liquid inlet to form cross-flow liquid for heat exchange, and the other part flows to the jet entry cavity, mixes with gas flowing in from an inlet port, then is jet to the micro-channel plate through the jet holes for heat exchange, and is simultaneously mixed with the cooling liquid flowing from the cross-flow liquid inlet to micro-channels, so that the cooling liquid in the micro-channels is disordered, and finally flows out from the gas-liquid mixed flow outlet. The cross-flow liquid in the micro-channels is impacted by gas-liquid two-phase mixed jet to realize enhanced heat transfer and suppress micro-channel boiling instability. In addition, the heat sink also has the characteristics of compact structure, small size, simple manufacturing process and the like.

Description

technical field [0001] The invention relates to a novel microchannel radiator, in particular to a microchannel radiator with gas-liquid two-phase mixed injection. Background technique [0002] With the development of electronic chips in the direction of high integration, multi-function and miniaturization, the heat flux of the volume of the chip continues to increase, and the heat generated cannot be taken away in time, which will lead to a rapid rise in the temperature of the device and the system, which will seriously affect Stable and reliable operation of electronic devices. Therefore, micro-channel heat sinks with high-efficiency heat dissipation performance and compact packaging have become an ideal choice. The inlet and outlet of the traditional microchannel heat sink are respectively located at both ends of the heat dissipation device. The microchannel is coupled with the cover plate to encapsulate the cooling microchannel, and it is connected with the outside world...

AI Technical Summary

Problems solved by technology

In traditional micro-channel coolers, there is insufficient heat exchange between the radiator and the coolant, so that the heat cannot be completely removed, and at the same time, the pressure drop increases when the coolant inlet velocity increases

In addition, when the coolant in the microchannel boils, the rapid generation of boiling bubbles in the microchannel can easily lead to boiling instability, which poses a serious problem to the stable operation of the microchannel heat dissipation system.

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