Scrapping method of printed circuit board

Abstract

The invention provides a scrapping method of printed circuit boards. The method is characterized in that the method comprises following steps of S1, a preprocessing step: acquiring a printed circuit board finished product after the preprocessing step, wherein a copper patch is arranged on the printed circuit board finished product; S2, appearance examination of the copper patch; S3, electrical performance test: carrying out electrification test on the printed circuit board finished product; and S4: carrying out scrapping processing on a printed circuit board with abnormal appearance in the step S2 or on a circuit board which fails to pass the electrical performance test, wherein the printed circuit board comprises conductive copper patch with a copper skin layer and a rubber layer, and connecting the conductive copper patch with the copper patch so as to allow the conductive copper patch to be conducted with a circuit diagram layer of the printed circuit board to form a short circuit,thereby finishing scrapping of the printed circuit board. According to the invention, the yield of the product is high; the production cost is low; and production efficiency is high.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a scrapping method for printed circuit boards. Background technique [0002] Printed circuit board (referred to as PCB) is an important part of electronic products. In recent years, with the development of the electronics industry, the production of printed circuit boards has developed extremely rapidly. During the processing of printed circuit boards, some scrapped or unqualified intermediate products of circuit boards are often produced. These scrapped intermediate products are crushed to obtain copper-containing dust, and the copper content is as high as 20-30%. The remaining organic materials are mainly Glass fiber, if these wastes are directly incinerated, landfilled or discarded, it will not only waste resources, but also cause serious pollution to the environment. It is a major event of strategic significance to realize the resource utilizatio...

AI Technical Summary

Problems solved by technology

[0004] There are two main methods of scrapping traditional printed circuit boards: 1. Destructive scrapping methods (punching / pneumatic pen grinding, etc.), such methods are prone to produce copper scraps and cause abnormalities such as short circuits, resulting in unnecessary scrapping; 2. Scratching Line marking scrapping method (white paint pen, etc.), the materials used in this method are not quick-drying, it takes a certain time to dry or dry, must have personnel, space and equipment, and affect the turnover efficiency of the production line

With the development of science and technology, the line width and spacing are becoming denser and denser, and the impact of copper shavings on the yield rate is also increasing; at the same time, personnel, space and equipment require greater investment

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