Grinding wheel capable of easily removing chips
A grinding wheel and substrate technology, applied in the field of grinding wheels, can solve the problems of heat dissipation effect, accelerated grinding wheel wear, accumulation of wear debris, etc., and achieve the effects of facilitating safe production, increasing chip removal channels, and increasing heat dissipation area
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0030] The technical solutions of the various embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.
[0031] Such as figure 1 , figure 2 As shown, there is provided an easy chip removal grinding wheel, comprising a grinding wheel base 1, a mounting shaft hole 5 is opened at the center of the grinding wheel base 1, an abrasive layer 2 is provided on one side of the grinding wheel base 1, and the The central position of the abrasive material layer 2 is provided with a relief installation hole 6 corresponding to the installation shaft hole 5, and the end surface of the abrasive mat...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com