Complementary type resistive random access memory based on GeTe and preparation method thereof
A resistive variable memory, complementary technology, applied in the direction of electrical components, etc., can solve problems such as crosstalk of resistive variable devices, and achieve the effects of easy high-density integration, stable performance, and increased storage density
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Embodiment 1
[0032] Such as figure 1 As shown, a GeTe-based complementary resistive variable memory of the present embodiment includes a bottom conductive electrode 3; a GeTe thin film dielectric layer 2 on the upper surface of the bottom conductive electrode; a GeTe thin film dielectric layer on the upper surface Top conductive electrode 1;
[0033] The bottom conductive electrode 3 is made of TiN, has a thickness of 200nm, is rectangular in shape, and has a side length of 0.4 μm;
[0034] The GeTe thin film dielectric layer 2 has a thickness of 20 nm, a rectangular shape, and a side length of 0.4 μm;
[0035] The top conductive electrode 1 is made of Pt, has a thickness of 250 nm, and is rectangular in shape with a side length of 0.4 μm.
[0036] The preparation method of the above-mentioned GeTe-based complementary resistive memory comprises the following steps:
[0037] The bottom conductive electrode is prepared on the substrate; a GeTe thin film medium layer is prepared on the upp...
Embodiment 2
[0042] A GeTe-based complementary RRAM in this embodiment includes a bottom conductive electrode; a GeTe thin film dielectric layer disposed on the upper surface of the bottom conductive electrode; and a top conductive electrode disposed on the upper surface of the GeTe thin film dielectric layer.
[0043] The bottom conductive electrode is made of TiN with a thickness of 200 nm and a rectangular shape with a side length of 0.6 μm.
[0044] The dielectric layer of the GeTe thin film has a thickness of 20 nm and a rectangular shape with a side length of 0.6 μm.
[0045] The top conductive electrode is made of Pt, has a thickness of 250 nm, and is rectangular in shape with a side length of 0.6 μm.
[0046] The preparation method of the above-mentioned GeTe-based complementary resistive variable memory in this embodiment includes the following steps: preparing the bottom conductive electrode on the substrate; preparing a GeTe thin film dielectric layer on the upper surface of the...
Embodiment 3
[0051] A GeTe-based complementary RRAM in this embodiment includes a bottom conductive electrode; a GeTe thin film dielectric layer on the upper surface of the bottom conductive electrode; and a top conductive electrode on the upper surface of the GeTe thin film dielectric layer.
[0052] The bottom conductive electrode is made of TiN with a thickness of 200 nm and a rectangular shape with a side length of 0.8 μm.
[0053] The dielectric layer of the GeTe thin film has a thickness of 20 nm and a rectangular shape with a side length of 0.8 μm.
[0054] The top conductive electrode is made of Pt, has a thickness of 250 nm, and is rectangular in shape with a side length of 0.8 μm.
[0055] The preparation method of the above-mentioned GeTe-based complementary resistive memory comprises the following steps:
[0056] The bottom conductive electrode is prepared on the substrate; a GeTe thin film medium layer is prepared on the upper surface of the bottom conductive electrode; a top...
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