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Complementary type resistive random access memory based on GeTe and preparation method thereof

A resistive variable memory, complementary technology, applied in the direction of electrical components, etc., can solve problems such as crosstalk of resistive variable devices, and achieve the effects of easy high-density integration, stable performance, and increased storage density

Active Publication Date: 2018-10-16
HUBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a GeTe-based complementary resistive memory and its preparation method to solve the problem of crosstalk of resistive memory devices.

Method used

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  • Complementary type resistive random access memory based on GeTe and preparation method thereof
  • Complementary type resistive random access memory based on GeTe and preparation method thereof

Examples

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Embodiment 1

[0032] Such as figure 1 As shown, a GeTe-based complementary resistive variable memory of the present embodiment includes a bottom conductive electrode 3; a GeTe thin film dielectric layer 2 on the upper surface of the bottom conductive electrode; a GeTe thin film dielectric layer on the upper surface Top conductive electrode 1;

[0033] The bottom conductive electrode 3 is made of TiN, has a thickness of 200nm, is rectangular in shape, and has a side length of 0.4 μm;

[0034] The GeTe thin film dielectric layer 2 has a thickness of 20 nm, a rectangular shape, and a side length of 0.4 μm;

[0035] The top conductive electrode 1 is made of Pt, has a thickness of 250 nm, and is rectangular in shape with a side length of 0.4 μm.

[0036] The preparation method of the above-mentioned GeTe-based complementary resistive memory comprises the following steps:

[0037] The bottom conductive electrode is prepared on the substrate; a GeTe thin film medium layer is prepared on the upp...

Embodiment 2

[0042] A GeTe-based complementary RRAM in this embodiment includes a bottom conductive electrode; a GeTe thin film dielectric layer disposed on the upper surface of the bottom conductive electrode; and a top conductive electrode disposed on the upper surface of the GeTe thin film dielectric layer.

[0043] The bottom conductive electrode is made of TiN with a thickness of 200 nm and a rectangular shape with a side length of 0.6 μm.

[0044] The dielectric layer of the GeTe thin film has a thickness of 20 nm and a rectangular shape with a side length of 0.6 μm.

[0045] The top conductive electrode is made of Pt, has a thickness of 250 nm, and is rectangular in shape with a side length of 0.6 μm.

[0046] The preparation method of the above-mentioned GeTe-based complementary resistive variable memory in this embodiment includes the following steps: preparing the bottom conductive electrode on the substrate; preparing a GeTe thin film dielectric layer on the upper surface of the...

Embodiment 3

[0051] A GeTe-based complementary RRAM in this embodiment includes a bottom conductive electrode; a GeTe thin film dielectric layer on the upper surface of the bottom conductive electrode; and a top conductive electrode on the upper surface of the GeTe thin film dielectric layer.

[0052] The bottom conductive electrode is made of TiN with a thickness of 200 nm and a rectangular shape with a side length of 0.8 μm.

[0053] The dielectric layer of the GeTe thin film has a thickness of 20 nm and a rectangular shape with a side length of 0.8 μm.

[0054] The top conductive electrode is made of Pt, has a thickness of 250 nm, and is rectangular in shape with a side length of 0.8 μm.

[0055] The preparation method of the above-mentioned GeTe-based complementary resistive memory comprises the following steps:

[0056] The bottom conductive electrode is prepared on the substrate; a GeTe thin film medium layer is prepared on the upper surface of the bottom conductive electrode; a top...

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Abstract

The invention discloses a complementary type resistive random access memory based on GeTe and a preparation method thereof, and relates to the fields of novel micro-nano electronic materials and functional devices. The complementary type resistive random access memory disclosed by the invention comprises a bottom conducting electrode, a GeTe film dielectric layer arranged on the upper surface of the bottom conducting electrode and a top conducting electrode arranged on the upper surface of the GeTe film dielectric layer, wherein the bottom conducting electrode, the GeTe film dielectric layer and the top conducting electrode are prepared and obtained through a magnetron sputtering method. Resistance state switching occurs on the GeTe film dielectric layer to realize a complementary type resistive random access function through electric excitation and limiting current. The memory provided by the invention effectively solves the problem of current crosstalk in a cross array of the resistive random access memory, has the characteristics of simple preparation method, low cost, stable performance, high scaling performance and the like, and has excellent development potentials and application values in the aspect of developing nanoscaled nonvolatile memories with high memory density and low power consumption.

Description

technical field [0001] The invention relates to the field of novel micro-nano electronic materials and functional devices, in particular to a GeTe-based complementary resistive memory and a preparation method thereof. Background technique [0002] Traditional flash memory technology will face a series of technical limitations and theoretical limits after shrinking to a technology node below 20nm, and it is difficult to meet the ultra-high-density storage requirements. Therefore, it is of great significance and value to develop new storage technologies. At present, the resistive memory device developed based on the electroresistive effect has become a strong competitor for the next generation of non-volatile memory technology due to its simple structure, fast response speed, low operating power consumption, easy integration and non-volatility. have a broad vision of application. [0003] The main way to miniaturize resistive memory devices and achieve ultra-high density inte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L45/00
CPCH10N70/801H10N70/8828H10N70/026
Inventor 王浩何玉立马国坤陈钦陈傲刘春雷
Owner HUBEI UNIV
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