Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Double-open-loop miniaturized equalizer

A double-opening, equalizer technology, applied in the direction of impedance network, electrical components, multi-terminal pair network, etc., to achieve the effect of reducing lateral size, large equalization amount, and simple structure

Inactive Publication Date: 2018-10-12
UNIV OF ELECTRONIC SCI & TECH OF CHINA
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the following problems in the traditional uniform impedance resonator (UIR) and step impedance resonator (SIR):

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Double-open-loop miniaturized equalizer
  • Double-open-loop miniaturized equalizer
  • Double-open-loop miniaturized equalizer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments.

[0037] like figure 1 , 2 As shown, the double split ring miniaturized equalizer of the present invention is characterized in that it includes a microstrip layer 1, a dielectric layer 2 and a metal layer 3, and the microstrip layer 1, the dielectric layer 2 and the metal layer 3 are sequentially stacked from top to bottom ; The microstrip layer 1 is located on the uppermost layer, and the metal layer 3 is located on the lowermost layer.

[0038] Described microstrip layer 1 comprises microstrip main transmission line 10, first resistance 11 and second resistance 12, and microstrip main transmission line 10 is strip shape; First resistance 11 and second resistance 12 are connected on the left and right sides of microstrip main transmission line 10 both sides;

[0039] The microstrip layer 1 also includes a first open ring surface microstrip 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Line widthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a double-open-loop miniaturized equalizer. The double-open-loop miniaturized equalizer comprises a micro-strip layer, a dielectric layer and a metal layer which are sequentially stacked from top to bottom; the micro-strip layer further comprises a first double-open-loop resonator and a second double-open-loop resonator with the same structure; one end of a first open ring surface micro-strip is connected with a first resistor, and the other end of the first open ring surface micro-strip is of an open ring structure; the circle center of the open ring structure of the first open ring surface micro-strip and the circle center of the open ring structure of a first inner open ring surface micro-strip are located at the same point; and one end of the first inner open ring surface micro-strip is connected with the metal layer, and the other end of the first inner open ring surface micro-strip is of an open ring structure. According to the double-open-loop miniaturizedequalizer provided by the invention, a novel resonant structure is adopted as a resonant unit of the double-open-loop miniaturized equalizer, the structure is simple and the size is small; since thestructure has a lot of variable parameters, the double-open-loop miniaturized equalizer is more flexible than a traditional transmission line structure resonator, and can realize a complicated equalization curve; and besides, the double-open-loop miniaturized equalizer has a larger equalization amount and a large bandwidth.

Description

technical field [0001] The invention relates to the technical field of equalizers, in particular to a miniaturized equalizer with many structural variable parameters and capable of realizing complex equalization curves. Background technique [0002] The power gain equalizer is a two-port network that produces specific attenuation of the input signal at different frequencies. It is generally used to correct the output power of the previous stage to adapt to the uneven gain curve of the high-power device in the subsequent stage. It is used in microwave communications and radar It plays an important role in systems such as transmitters. [0003] In the prior art, the equalizer is generally composed of a microstrip resonator and a resistor, and has a relatively complete circuit topology and design steps. For the traditional uniform impedance resonator (UIR) and step impedance resonator (SIR), it is usually composed of simple microstrip stubs. This structure design is simple and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H03H7/06
CPCH03H7/06
Inventor 夏雷王子健郭文瑛李博
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products