A kind of preparation method of electronic component

A technology of electronic components and tempered glass, which is applied in the direction of electrical components, resistance manufacturing, circuits, etc., can solve the problems of reduced service life of electronic components, low hardness of electronic components, general conductivity, etc., to reduce processing time, improve conductivity, The effect of low cost of weak base

Active Publication Date: 2020-04-28
佛山市信鼎电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a method for preparing electronic components, which has the advantages of fast processing speed, high production efficiency, cost saving, high hardness, good toughness, and excellent electrical conductivity, and solves the existing problems. The preparation method has low production efficiency, slow processing, high processing cost, and the obtained electronic components have low hardness, poor toughness, and general electrical conductivity, which greatly reduces the service life of electronic components.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This embodiment provides a method for preparing an electronic component, and the specific steps are as follows:

[0024] S1: Put ordinary glass in a combustion dish and heat it to 600°C, then quickly and evenly cool it to obtain tempered glass, mix 65% tempered glass with 35% aluminum oxide by weight, and crush it with a crusher for 30 minutes to form particles ;

[0025] S2: Grind the particles obtained in S1 into powder through a pulverizer, add an organic solvent and stir at 50°C for 40 minutes, then add acrylic resin, sodium hexametaphosphate and toughening agent, stir at 20°C for 2 hours to obtain a slurry ;

[0026] S3: adding a weak base to the slurry to adjust the pH of the slurry to 7.3, and then coating the slurry on the film substrate by printing to make a conductive electrode;

[0027] S4: Take a silver foil with a thickness of 0.1 mm and cover it on the film substrate, make it integrally formed by a hot press, cool and dry for 1 hour, and obtain an electr...

Embodiment 2

[0030] This embodiment provides a method for preparing an electronic component. The specific steps are as follows: S1: Put ordinary glass in a combustion dish and heat it to 650° C., and then quickly and uniformly cool it to obtain toughened glass. 30% by weight of alumina is mixed and crushed by a crusher with a rotating speed of 500r / min for 50 minutes to form particles;

[0031] S2: Grind the particles obtained in S1 into powder through a pulverizer, add an organic solvent and stir at 60°C for 50 minutes, then add acrylic resin, sodium hexametaphosphate and toughener, and stir at 28°C for 3 hours to obtain a slurry ;

[0032] S3: adding a weak base to the slurry to adjust the pH of the slurry to 7.7, and then coating the slurry on the film substrate by printing to make a conductive electrode;

[0033] S4: Take a silver foil with a thickness of 0.2 mm and cover it on the film substrate, make it integrally formed by a hot press, cool it and dry it for 2 hours to obtain an el...

Embodiment 3

[0036] This embodiment provides a method for preparing an electronic component. The specific steps are as follows: S1: Put ordinary glass in a combustion dish and heat it to 625° C., and then quickly and uniformly cool it to obtain toughened glass. 33% by weight of alumina mixed, crushed by a crusher for 40 minutes to form particles;

[0037] S2: Grind the particles obtained in S1 into powder through a pulverizer, add an organic solvent and stir at 55°C for 45 minutes, then add acrylic resin, sodium hexametaphosphate and toughener, and stir at 24°C for 2.5 hours to obtain a slurry material;

[0038] S3: adding a weak base to the slurry to adjust the pH of the slurry to 7.5, and then coating the slurry on the film substrate by printing to make a conductive electrode;

[0039] S4: Take a silver foil with a thickness of 0.15 mm and cover it on the film substrate, make it integrally molded by a hot press, cool and dry for 1.5 hours to obtain an electronic component.

[0040]Wher...

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Abstract

The invention discloses a preparation method for an electronic component. The preparation method comprises the following steps: S1, heating ordinary glass in a combustion vessel to 600-650 DEG C, andthen rapidly and uniformly cooling the glass to obtain tempered glass, mixing 65-70% by weight of the tempered glass with 30-35% by weight of alumina, and carrying out crushing with a crusher for 30-50 minutes to form a particulate matter; S2, grinding the particulate matter obtained in the step S1 into powder, adding an organic solvent, carrying out stirring at 50-60 DEG C for 40-50 min, then adding acrylic resin, sodium hexametaphosphate and a toughening agent; S3, adding a weak base into slurry obtained in the step S2 to adjust the pH value of the slurry to 7.3-7.7, and then coating a filmsubstrate with the slurry through printing to prepare a conductive electrode; and S4, covering the film substrate with a silver foil having a thickness of 0.1-0.2 mm, carrying out integral molding with a hot press, carrying out cooling and then carrying out drying for 1-2 hours so as to obtain the electronic component. The preparation method provided by the invention has the advantages of high processing speed and high production efficiency; and the obtained electronic component has high hardness, good toughness and excellent electrical conductivity.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a method for preparing electronic components. Background technique [0002] Electronic components are the basis of electronic products. Commonly used electronic components include resistors, capacitors, inductors, potentiometers, and transformers. With the continuous development of artificial intelligence technology, signals in different frequency bands need to be processed in actual circuits, which puts forward higher requirements for electronic components. In order to meet the multiple uses of the same electronic component, the traditional single material manufacturing Electronic components can no longer meet the needs of use. It is necessary to introduce two or more materials to meet the design requirements. However, at present, the appearance and electrical performance of electronic components made of more than two materials often have poor conditions. [0003]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/00H01C17/28
CPCH01C17/00H01C17/283
Inventor 王玉环
Owner 佛山市信鼎电子科技有限公司
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