Two-component glue for blending fluorescent powder and preparation method thereof
A fluorescent powder, two-component technology, applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problems that affect the luminous quality and life of LED lamps, poor UV resistance, poor adhesion, etc., to achieve Improve luminous quality and service life, good UV resistance and good adhesion
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Embodiment 1
[0023] Each component and weight part of described A agent:
[0024] 45 parts of modified epoxy resins;
[0025] 43 parts of aliphatic epoxy resin;
[0026] 1.5 parts of auxiliary agent;
[0027] Each component and parts by weight of the B agent:
[0028] 97 copies of imported methylhexahydrobenzene;
[0029] Accelerator 1 part.
[0030] In this embodiment, the auxiliary agent is a defoamer.
[0031] In the embodiment of the present invention, the preparation method of the two-component fluorescent powder-adjusting glue includes the following steps:
[0032] Step S1. Weigh each component of the agent A according to parts by weight, mix and stir the weighed modified epoxy resin and aliphatic epoxy resin evenly, add and weigh according to parts by weight during the stirring process Additives to eliminate foam generated during stirring;
[0033] Step S2, weighing each component of the agent B according to parts by weight, and mixing and stirring the weighed components even...
Embodiment 2
[0038] Each component and weight part of described A agent:
[0039] 50 parts of modified epoxy resins;
[0040] 48 parts of aliphatic epoxy resin;
[0041] 2 parts of auxiliary agent;
[0042] Each component and parts by weight of the B agent:
[0043] 98 parts of imported methylhexahydrobenzene;
[0044] Accelerator 2 parts.
[0045] In this embodiment, the auxiliary agent is a defoamer.
[0046] In the embodiment of the present invention, the preparation method of the two-component phosphor-adjusting glue is the same as or similar to the steps in embodiment 1. The only difference between it and embodiment 1 is the curing process in step S4. In this embodiment In the example, the curing process is as follows: the curing temperature is 120° C., and the curing time is 60 minutes.
Embodiment 3
[0048] Each component and weight part of described A agent:
[0049] 55 parts of modified epoxy resins;
[0050] 52 parts of aliphatic epoxy resin;
[0051] 3 parts of defoamer;
[0052] Each component and parts by weight of the B agent:
[0053] 99 parts of imported methylhexahydrobenzene;
[0054] Accelerator 3 parts.
[0055] In the embodiment of the present invention, the preparation method of the two-component phosphor-adjusting glue is the same as or similar to the steps in embodiment 1. The only difference between it and embodiment 1 is the curing process in step S4. In this embodiment In the example, the curing process is as follows: the curing temperature is 130° C., and the curing time is 45 minutes.
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