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Full-duplex Internet of Things base station based on half-duplex baseband chip

A baseband chip, full-duplex technology, applied in the field of Internet of Things, can solve problems such as serious constraints and affect network communication efficiency, and achieve the effect of maintaining normal work, improving communication efficiency and low cost

Inactive Publication Date: 2018-09-28
BEIJING SENSORO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a half-duplex communication mode greatly affects the efficiency of network communication, especially when there are a large number of network terminal nodes and concurrent uplink and downlink are required, the constraints are particularly serious

Method used

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Embodiment Construction

[0022] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0023] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0024] Those skilled in the art will understand that unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that when an element is referred to as being "connected" or "coupled" to another el...

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Abstract

The invention discloses a full-duplex Internet of Things base station based on a half-duplex baseband chip. The base station comprises a processor, a receiving module and a transmitting module, wherein the receiving module comprises a first radio frequency switch, a low noise amplifier, a radio frequency front end and the half-duplex baseband chip that are sequentially connected and configured ina receiving state; the transmitting module comprises a transceiver, a power amplifier and a second radio frequency switch in a transmitting state that are sequentially connected; the processor is connected to the half-duplex baseband chip of the receiving module through a bus to perform interaction between data and control instructions; and the processor is also connected with the transceiver of the transmitting module through the bus to perform the interaction between the data and the control instructions. By adopting the scheme of the invention, the defect that an existing Internet of Thingsbase station can only realize half-duplex communication can be solved, the full-duplex real-time communication can be realized, and the communication efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of the Internet of Things, in particular to a full-duplex Internet of Things base station based on a half-duplex baseband chip. Background technique [0002] At present, the LPWAN IoT base stations based on the LoRaWAN protocol in the market all use Semtech's SX1301 baseband chip, plus two SX1255 or SX1257 RF front-end chips to form a solution with 8 uplinks and 1 downlink. However, since the SX1301 is a half-duplex wireless modem baseband chip, its working mode can only use half-duplex mode to communicate with the terminal, and the base station cannot work in both receiving and transmitting modes at the same time, which limits the communication between the base station and the terminal. communication efficiency between them. Since the LPWAN IoT base station has a wide coverage area and can simultaneously receive data from thousands of terminal nodes within a few square kilometers, the half-duplex communica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/401H04L5/16H04W56/00H04W88/10
CPCH04B1/401H04L5/16H04W56/00H04W88/10
Inventor 沈建华赵武阳赵东炜
Owner BEIJING SENSORO
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