OLED display panel and packaging method
An encapsulation method and panel technology, which are applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of OLED devices being susceptible to water vapor and oxygen intrusion, black spots, electrode oxidation, etc.
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[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0033] see figure 1 , figure 1 A schematic cross-sectional view of an OLED panel provided by an embodiment of the present invention.
[0034] An embodiment of the present invention provides an OLED panel, including:
[0035] A light-emitting substrate 10, and at least one set of packaging films 20 disposed on the light-emitting substrate;
[0036] Each set of packaging films 20 includes a first inorganic layer 201 disposed on the light-emitting substrate, an organic ...
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