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OLED display panel and packaging method

An encapsulation method and panel technology, which are applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of OLED devices being susceptible to water vapor and oxygen intrusion, black spots, electrode oxidation, etc.

Active Publication Date: 2018-09-28
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing packaging methods still make the edges of OLED devices susceptible to water vapor and oxygen intrusion, which in turn causes phenomena such as electrode oxidation, poor chemical reactions of organic materials, or black spots, resulting in reduced service life of OLED devices

Method used

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  • OLED display panel and packaging method
  • OLED display panel and packaging method
  • OLED display panel and packaging method

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0033] see figure 1 , figure 1 A schematic cross-sectional view of an OLED panel provided by an embodiment of the present invention.

[0034] An embodiment of the present invention provides an OLED panel, including:

[0035] A light-emitting substrate 10, and at least one set of packaging films 20 disposed on the light-emitting substrate;

[0036] Each set of packaging films 20 includes a first inorganic layer 201 disposed on the light-emitting substrate, an organic ...

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Abstract

The invention provides an OLED panel and a packaging method. The OLED panel comprises a light-emitting substrate, and at least one group of packaging films arranged on the light-emitting substrate, wherein each group of packaging films comprise a first inorganic layer arranged on the light-emitting substrate; each first inorganic layer is provided with an organic layer; an organic retaining wall is arranged in an edge region of each organic layer; each organic layer is blocked in the corresponding organic retaining wall and is provided with a second inorganic layer covering the corresponding first inorganic layer, organic layer and organic retaining wall; and each organic retaining wall is filled with a water-absorbing material to improve the water-oxygen blocking ability of the OLED panel. The target of improving the blocking ability on water vapor and oxygen is achieved through arranging one organic retaining wall in the edge region of each organic layer and filling each organic retaining wall with the water-absorbing material, thereby prolonging the service life of the OLED panel.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED panel and a packaging method. Background technique [0002] OLED (Organic Light Emitting Diode, Organic Light Emitting Diode), as a current-type light-emitting device, is widely used because of its advantages such as self-illumination, rich colors, fast response speed, wide viewing angle, light weight, and flexible display. focus on. [0003] However, OLED devices are very sensitive to moisture and oxygen, and therefore, encapsulation of OLED devices is usually required. The existing encapsulation method still makes the edge of the OLED device susceptible to water vapor and oxygen intrusion, which in turn causes phenomena such as electrode oxidation, poor chemical reaction of organic materials, or black spots, thereby reducing the service life of the OLED device. [0004] Therefore, it is necessary to provide an OLED panel and a packaging method to solve the problems e...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/846H10K50/844H10K71/00
Inventor 程家有金东焕蔡丰豪
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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