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Automatic electronic ceramic material manufacturing technology equipment

A manufacturing technology, electronic ceramic technology, applied in the field of automated electronic ceramic material manufacturing technology and equipment, can solve the problems of high labor intensity, difficult to guarantee cleanliness, difficult to collect, etc.

Inactive Publication Date: 2018-09-28
益福光(天津)电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double-sided) at high temperature. Ceramic substrate has a large loading capacity. Current capacity has become the basic material of high-power power electronic circuit structure technology and interconnection technology. Drilling operations are often required in the processing and production of ceramic substrates. Traditional ceramic substrate drilling devices are mostly hand-held structures. It requires too much manpower to operate, and its labor intensity is high and the work efficiency is low. At the same time, it is easy to generate more powder during the drilling process, which is difficult to collect and difficult to guarantee cleanliness.

Method used

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  • Automatic electronic ceramic material manufacturing technology equipment
  • Automatic electronic ceramic material manufacturing technology equipment
  • Automatic electronic ceramic material manufacturing technology equipment

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Embodiment Construction

[0015] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0016] Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0017] Such as Figure 1-3 As shown, an automated electronic ceramic material manufacturing technical equipment of the device of the present invention includes a base 10, a support column 11 fixedly arranged on the left side of the base 10 and extending upward, and a support column 11 fixedly arranged on the right side of the support column 11. The crossbeam 12 extending to the right at the top of the side, the bottom end surface of the cross...

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Abstract

The invention discloses automatic electronic ceramic material manufacturing technology equipment which comprises a base, a support pillar fixedly arranged on the left side of the base and extending upwards, and a cross beam fixedly arranged on the top part of the right side of the support pillar and extending rightwards. A first sliding chute provided with a downward opening and extending left andright is formed in the bottom end surface of the cross beam; a sliding frame is slidably arranged in the first sliding chute; a second sliding chute with a leftward opening is formed in the bottom part of the left side end surface of the sliding frame; a connecting block is arranged in the second sliding chute in an up-and-down sliding way; and a connecting arm stretching out of the left side endsurface of the sliding frame is fixedly arranged on the left side end surface of the connecting block.

Description

technical field [0001] The invention relates to the technical field of novel material processing and production, in particular to an automatic electronic ceramic material manufacturing technical equipment. Background technique [0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double-sided) at high temperature. Ceramic substrate has a large loading capacity. Current capacity has become the basic material of high-power power electronic circuit structure technology and interconnection technology. Drilling operations are often required in the processing and production of ceramic substrates. Traditional ceramic substrate drilling devices are mostly hand-held structures. It requires too much manpower to operate, and its labor intensity is high and the work efficiency is low. At the same time, it is easy to produce more powder debris d...

Claims

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Application Information

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IPC IPC(8): B28D1/14B28D7/00B28D7/02B28D7/04
CPCB28D1/14B28D7/00B28D7/02B28D7/04
Inventor 李瑞峰
Owner 益福光(天津)电子科技有限公司
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