Diamond Wire Slicing Silicon Wafer Breaking Wire Entry Method
A technology of diamond wire cutting and diamond wire, which is applied in the field of diamond wire cutting silicon wafers into the knife, which can solve the problems of wasting silicon wafers, breaking silicon wafers, and increasing costs, and achieve the effect of convenient re-cutting
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[0038] Further, see figure 1 , as a specific embodiment of the diamond wire cutting method for silicon chip fragmentation provided by the present invention, the diameter of the diamond wire with a smaller diameter is 50-60um. The purpose of changing to a diamond wire with a smaller diameter is to allow the diamond wire to re-enter the gap in the silicon block, and it is easy to insert into the gap, so that the diamond wire with a diameter of 70um is convenient for re-entry.
[0039] Further, see figure 1 , as a specific implementation of the diamond wire cutting method for cutting silicon slices into a knife provided by the present invention, the torque for tightening the lead screw of the pay-off shaft is 80 Nm.
[0040] Further, see figure 1 , as a specific embodiment of the diamond wire cutting silicon chip broken wire feeding method provided by the present invention, the processing in the step 5) includes washing the guide wheel of the cutting wire net, washing the silic...
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