Mask developing method and apparatus

Abstract

The invention provides a mask developing method. The invention also provides a developing apparatus adopting the method. By virtue of the developing method and apparatus, uniform covering of a developing liquid in the center and the edge of a mask can be ensured, and developing with mask strip width uniformity can be realized. The mask developing method is characterized in that a developing sprayer is arranged above a circular bearing table; the developing sprayer has a rectangular transverse section; the length of the diagonal of the developing sprayer is not less than the diameter of the circular bearing table, and the developing sprayer is arranged horizontally parallel to the circular bearing table; spraying holes in rectangular array distribution are uniformly distributed in the lowerend plane of the developing sprayer; the spraying holes are arranged in a perpendicularly downward manner; the mask is fixedly mounted on the upper end plane of the bearing table; when the bearing table is driven to rotate, the developing sprayer pumps the developing liquid through a liquid pump to pass through the spraying holes to cover the surface region corresponding to the mask on the lowerside; and in the mask rotating process, the developing liquid uniformly covers the center and the edge of the mask.

Description

technical field [0001] The invention relates to the technical field of mask development, in particular to a mask development method, and the invention also provides a development device using the method. Background technique [0002] Due to the effect of Moore's law, semiconductor devices become smaller and smaller, and the size of the pattern formed on the wafer is also reduced. With the increase of the wafer size and the improvement of the development resolution requirements, the bar The requirement for width uniformity is also increasing. Since the stripe width of the mask and the wafer has a certain proportional projection relationship, the requirement for the stripe width uniformity of the mask is also becoming more and more stringent. Among them, development has a great influence on the uniformity of line width. In the past development method, a number of spray pipes are arranged above the film forming platform, and then each spray pipe is connected to a nozzle, so tha...

AI Technical Summary

Problems solved by technology

Among them, development has a great influence on the uniformity of line width. In the past development method, a number of spray pipes are arranged above the film forming platform, and then each spray pipe is connected to a nozzle, so that the developer sprayed by the nozzle is coated on the Fixed on the mask of the forming table, since the nozzle cannot cover all the areas, it will cause the problem of poor strip width uniformity caused by uneven developer coverage at the center and edges

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