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A leadless electroplating method based on finger joint pre-size

A connection position, no lead wire technology, applied in the direction of transfer printing, printed circuit, electrical components, etc., can solve the problem of corroded signal lines, etc., to achieve the effect of preventing corrosion of the gold surface, improving corrosion resistance, and improving appearance

Active Publication Date: 2019-12-13
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the problem of the above-mentioned defects in the existing PCB, and provides a leadless electroplating method based on finger connection position pre-enlargement, adopting the electroplating method without the residual problem of electroplating lead wires in the traditional method, and improving signal integrity and breakdown resistance; no The signal lines of the traditional chemical etching de-leading method are thin and the signal line is broken

Method used

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  • A leadless electroplating method based on finger joint pre-size
  • A leadless electroplating method based on finger joint pre-size
  • A leadless electroplating method based on finger joint pre-size

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Such as figure 1 and figure 2 As shown in this embodiment, a leadless electroplating method based on pre-large finger connection positions includes the following processing steps in sequence:

[0029] (1) Cutting: cut out the core board according to the panel size of 320mm×420mm, the thickness of the core board is 0.5mm, and the thickness of the outer copper surface of the core board is 0.5OZ.

[0030] (2), making the inner layer circuit (negative film process): according to the pattern positioning hole, use a vertical coating machine to coat the photosensitive film on the core plate. Grid exposure ruler (21 grid exposure ruler) completes the exposure of the inner layer circuit, after development, the inner layer circuit pattern is formed on the core board; inner layer etching, the core board after exposure and development is etched out of the inner layer circuit, the inner layer line width The measurement is 3mil; AOI on the inner layer, and then check the open and ...

Embodiment 2

[0047] A leadless electroplating method based on the pre-enlargement of the finger connection shown in this embodiment is basically the same as that of Embodiment 1, except that in step (11), when making the outer layer circuit, it is made by a negative film process, details as follows:

[0048] (11), making the outer layer circuit (negative film process): on the production board, use a vertical coating machine to coat photosensitive film 8, the film thickness of photosensitive film is controlled 8 μ m, adopt a fully automatic exposure machine, with 5-6 grid exposure ruler ( 21 grid exposure ruler) to complete the exposure of the outer layer circuit, after development, the outer layer circuit pattern 5 is formed in the outer layer circuit area of ​​the production board, and the outer layer circuit is etched out of the production board after exposure and development, and the outer layer circuit includes a pad 6 ; Outer layer AOI, and then check the open and short circuits of th...

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Abstract

The invention discloses a lead-free electroplating method based on a reserved larger finger connection position. The method comprises the following steps that a production board is provided, the surface of the production board comprises an external line area and a finger area, and finger positions to be electroplated are made in the finger area; the external line area in the production board is silk-screened with anti-electricity gold printing ink or a coating adhesive tape, and copper surfaces of the finger positions are exposed; a copper surface, not formed by etching, of the external line area is used for conducting, and the finger positions are electroplated to form coatings; an external line is prepared in the external line area; and solar mask preparation, surface processing and molding are carried out on the production board successively to form a finished board. According to the method, the external line part is prepared after that the larger finger connection position is reserved, a final graph is formed via twice graph transfer, the problem of a residual electroplating lead of a traditional method is avoided, the signal completeness and anti-breakdown performance can be improved, and the problem that a signal line is too thin and etched of a traditional lead-removing chemical etching method is avoided.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a leadless electroplating method based on pre-enlargement of finger connection positions. Background technique [0002] For PCBs that require electroplating for surface treatment, the mainstream implementation solution in the industry is to transfer graphics to form line graphics and finger area graphics at one time. Gold fingers (nickel-plated gold) can not be directly connected to the electroplating current, it is necessary to connect with the electroplating power supply by adding electroplating leads, and then cover the line part to complete the surface treatment of the fingers; after the electroplating process is completed, it is necessary to pass the physical Or chemically remove the plating leads to restore the original design intention of different networks disconnecting each other and achieve the electrical function of the PCB. This is the method ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18C25D5/02
CPCC25D5/02H05K3/188H05K2203/0531H05K2203/0723
Inventor 叶国俊周文涛李永妮
Owner SHENZHEN SUNTAK MULTILAYER PCB
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