Integrated circuit chip binding structure, preparation method thereof and display device

Abstract

The invention provides an integrated circuit chip binding structure, a preparation method thereof and a display device, and relates to the technical field of display. The structure can improve the problems that an integrated circuit chip binding structure cannot be flatly fitted with a substrate in the binding process, so that stress of the integrated circuit chip binding structure is uniform, andfurther, a conductive bump cannot stably and electrically contact with other devices or the integrated circuit chip binding structure is cracked in the prior art. The integrated circuit chip bindingstructure comprises a base, a plurality of conductive bumps and at least one supporting bump, the conductive bumps are arranged on the base and electrically connected with a chip in the base, the basecomprises a first area and a second area arranged on the periphery of the first area, the conductive bumps are arranged on the second area, and the supporting bumps are arranged on the base and arranged in the first area.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an integrated circuit chip binding structure, a preparation method thereof, and a display device. Background technique [0002] With the continuous development of display technology, large-sized display devices, such as liquid crystal displays, LCD TVs, and flat panel displays, and small and medium-sized electronic products such as mobile phones, digital cameras, etc., are mainly developed based on lightness, thinness, shortness, and smallness. The trend is to improve the comfort of use and facilitate portability. Under this development trend, it is required that the integrated circuit chip bonding structure in the display module has a high density and a small volume, and while connecting and transmitting input signals and output signals, it minimizes the occupation of the overall space of the display device. [0003] Integrated circuit chip bonding structure in the prior art, ...

AI Technical Summary

Problems solved by technology

[0006] Embodiments of the present invention provide an integrated circuit chip binding structure, its preparation method, and a display device, which can improve the binding process of the prior art due to the fact that the integrated circuit chip binding structure cannot be flatly bonded to the substrate, resulting in an integrated circuit chip. The bonding structure is unevenly stressed, which leads to the inability of the conductive bumps to achieve stable electrical contact with other devices or leads to crack problems in the bonding structure of the integrated circuit chip

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