Electronic component manufacturing equipment

Abstract

The invention belongs to the technical field of production of electronic products, and specifically relates to electronic component manufacturing equipment. The equipment includes a rack and a mold, and also includes a drainage mechanism and an air control mechanism; the mold includes a fixed groove with a top opening and a cover plate used for covering the fixed groove, the bottom of the fixed groove is provided with an air outlet with an air outlet one-way valve and an air inlet with an air inlet one-way valve, an injection molding port is arranged in the cover plate, and the cover plate isslidably connected with the fixed groove; the drainage mechanism includes a drainage rod, a rocker, a gear and a sliding rack; and the air control mechanism includes a cylinder, a piston and a pistonrod. By adoption of the scheme, resin can be effectively prevented from flowing to the bottoms of chips in an injection molding process, the risk of a chip lead short circuit is reduced, and the product yield is improved.

Description

Technical field [0001] The invention belongs to the technical field of electronic product production, and specifically relates to an electronic component manufacturing equipment. Background technique [0002] There are many types of electronic components. Single devices such as resistors and capacitors are called basic devices, while chips integrate many basic devices on a very small circuit board, so they are also called integrated circuits. The chip is very small, and it is the most important part of electronic products. It is responsible for computing and storage functions. The complete process of chip production includes several links such as chip design, wafer production, packaging production, and cost testing. The chip packaging is to install a shell outside the semiconductor integrated circuit chip, so as to place, fix, seal, protect and enhance the electrothermal performance of the chip, and the packaging process is also a bridge between the internal world of the chip an...

AI Technical Summary

Problems solved by technology

[0004] However, there are still the following defects in the current injection molding process: resin is injected from the side of the mold, not only it is easy for the resin to overflow to the bottom of the chip, resulting in overflow; moreover, the resin is easy to impact the lead wire at the end of the chip near the injection port, making each lead wire Under the action of the fluid, there is an offset and contact between them, causing a short circuit of the wires, resulting in the scrapping of the chip; increasing the defective rate of the product

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