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Chip-type fixed resistor and production method thereof

A technology of fixed resistors and manufacturing methods, applied in the direction of resistor manufacturing, resistors, resistor components, etc., can solve problems such as incapable IC circuit packaging, unfavorable circuit space costs, and affecting working circuits, so as to achieve good market development potential and save energy. The effect of low circuit space cost and low manufacturing cost

Active Publication Date: 2018-06-12
ZHAOQING EXSENSE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1) Due to their own structural reasons, cement resistors, wire-wound resistors, metal film resistors, carbon film resistors and SMD chip ceramic resistors all have their own inductance, basically forming a circuit inside them, resulting in the generation of their own inductance, resulting in their own inductance. Inductance often affects its working circuit, resulting in poor use
[0006] 2) The volume is large. Due to structural design and process requirements, the volume cannot be reduced, which is not conducive to saving circuit space costs
[0007] 3) It cannot be packaged together with IC circuits, and the application range is narrow
[0008] 4) The precision is low, the resistance precision can only reach 5-10% generally, the highest is only 1-3%

Method used

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  • Chip-type fixed resistor and production method thereof
  • Chip-type fixed resistor and production method thereof
  • Chip-type fixed resistor and production method thereof

Examples

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Embodiment Construction

[0042] see figure 1 and figure 2 , figure 1 It is a structural diagram of the first embodiment of the chip type fixed resistor of the present invention, figure 2 It is a structural diagram of the second embodiment of the chip type fixed resistor of the present invention.

[0043] The chip type fixed resistor provided by the present invention includes a substrate 1 and a metal electrode 2 .

[0044] The substrate 1 is a rectangular sheet structure, and its two surfaces are respectively the front and the back.

[0045] The substrate 1 is formed by mixing and sintering three kinds of powders: high alumina ceramic powder, precious metal powder and glass powder. In terms of mass percentage, the high alumina ceramic powder accounts for 60-99% of the mixed powder, the precious metal powder accounts for 0.5-30% of the mixed powder, and the glass powder accounts for 0.5-10% of the mixed powder.

[0046] Such as image 3 As shown, the noble metal particles formed after sintering...

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Abstract

The invention relates to a chip-type fixed resistor. The chip-type fixed resistor comprises a substrate and a metal electrode arranged on the surface of the substrate, wherein the substrate is formedby mixing and sintering high alumina ceramic powder, precious metal powder and glass powder, specifically, the high alumina ceramic powder accounts for 60 to 99 percent of mixed powder, the precious metal powder accounts for 0.5 to 30 percent of the mixed powder, and the glass powder accounts for 0.5 to 10 percent of the mixed powder. The invention also relates to the production method of the chip-type fixed resistor. The chip-type fixed resistor of the invention has the advantages of no generation of self inductance, simple structure, small size, applicability to an IC circuit, and high resistor precision.

Description

technical field [0001] The invention belongs to the technical field of electronic components, in particular to a chip-type fixed resistor and a manufacturing method thereof. Background technique [0002] In electrical circuits, fixed resistors are the most frequently used components. Today, as the manufacturing technology of resistor components is becoming more and more mature, the manufacturing process of fixed resistors is becoming more and more stable, and conventional fixed resistors are basically fixed in several styles. [0003] The existing fixed resistors include carbon film resistors, cement resistors, metal film resistors, thick film resistors, wirewound resistors and SMD chip ceramic resistors. The preparation of thick film resistors in the prior art is mainly by printing the resistor paste on the substrate, and then obtaining the required resistance value through laser adjustment to obtain a fixed resistor. The process is roughly as follows: put the ceramic subst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/00H01C1/142H01C17/00H01C17/28
CPCH01C1/142H01C7/00H01C17/006H01C17/28
Inventor 贺晓东段兆祥叶建开杨俊柏琪星唐黎民
Owner ZHAOQING EXSENSE ELECTRONICS TECH
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