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Interconnection interface test method and device and computing equipment

A test device and interconnect interface technology, applied in the field of testing, can solve problems such as inability to precisely control the processor, lack of test completeness, and inability to cover test scenarios, so as to reduce processing overhead, improve test efficiency and processing capability, and solve processing problems. The effect of excessive load on the

Active Publication Date: 2018-05-11
HUAWEI TECH CO LTD
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AI Technical Summary

Problems solved by technology

[0008] In order to ensure the reliability of the multi-processor system, it is necessary to test the interconnection interface of the multi-processor. The current test method used in the industry usually tests the physical layer and link layer of the interconnection interface in sequence after the operating system is started. However, The problem with the current test method is that the processor is tested during operation, which will cause the processor load to be too high. At the same time, the behavior of the processor cannot be precisely controlled, so that it cannot cover all test scenarios, and the test is not complete.

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  • Interconnection interface test method and device and computing equipment
  • Interconnection interface test method and device and computing equipment
  • Interconnection interface test method and device and computing equipment

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Embodiment Construction

[0073] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0074] see figure 1 , is a schematic structural diagram of a computing device provided by an embodiment of the present invention. In the embodiment of the present invention, the structure of the computing device 1 is described by taking two processors and two test devices as examples. The computing device 1 includes basic input Output system (Basic Input OutPut System, BIOS) 11, multiprocessor system, interconnect bus 16, cache 14, cache 15 and memory 17, multiproc...

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Abstract

The invention discloses an interconnection interface test method. The method comprises the steps that a first test device acquires a CC request message from a test mapping table; a second test deviceis determined according to a memory address, and the CC request message is sent to the second test device through an interconnection interface; a CC response message returned by the second test deviceaccording to the CC request message is received through the interconnection interface; and an expected response message associated with the CC request message is queried according to the test mappingtable, and when the expected response message is matched with the CC response message, it is determined that the interconnection interface of an associated first processor passes testing. The embodiment of the invention furthermore discloses computing equipment, a test device and a BIOS. By the adoption of the calculation scheme, the interconnection interface can be tested under the condition ofnot starting an operating system, test completeness is improved, and processing overhead of the processor is lowered.

Description

technical field [0001] The invention relates to the field of testing, in particular to a testing method, device and computing equipment for an interconnection interface. Background technique [0002] With the continuous development of integrated circuit production technology, the integration of processor chips is getting higher and higher, and multiple processors can be integrated on-chip to form a multi-processor system. Through a specially designed interconnection bus, multiple processors Realize point-to-point communication to increase the transfer rate between processors. Typical interconnect buses include a QPI (QuickPath Interconnect, QuickPath Interconnect) bus and an HT (HyperTransprot, HyperTransport) bus. [0003] The current interconnection bus mainly includes protocol layer, routing layer, link layer and physical layer. [0004] The protocol layer (Protocol Layer) is mainly used to maintain the cache coherence (Cache Coherency) of each processor in the multipro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/22
CPCG06F11/221G06F11/2273
Inventor 李生吴聿旻黄平
Owner HUAWEI TECH CO LTD
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