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A kind of high heat resistance organic flux and its application

A solder-preserving agent, an organic technology, applied in the field of high heat-resistant organic solder-preserving agents, can solve the problems of discoloration or cracks, affecting the solderability and reliability of the copper surface, shortening the service life of the organic soldering agent, etc. The effect of good oxidation resistance and thermal shock resistance

Active Publication Date: 2019-12-27
WINSTAR CHEM SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the evaporation of water and the increase of pH during use, crystal precipitation will inevitably occur, which will affect the processing of PCB and shorten the service life of organic flux
And some studies have shown that the OSP film obtained by using aryl-substituted imidazole is relatively thin, and the film layer is too thin to effectively protect the copper surface. The OSP film after multiple high-temperature soldering processes is likely to undergo discoloration or cracks, which will affect the solderability of the copper surface. sex and reliability

Method used

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  • A kind of high heat resistance organic flux and its application
  • A kind of high heat resistance organic flux and its application

Examples

Experimental program
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Effect test

preparation example Construction

[0044] As a preferred technical solution of the present invention, the preparation method of the described imidazo[1,5-a]pyrido[2,3-E]pyrazinone at least comprises the following steps:

[0045] Dissolve 0.1 mmol of 3-fluoro-2-nitropyridine and 0.1 mmol of imidazole in 10 mL of acetonitrile, add 0.4 mmol of potassium carbonate, stir at room temperature for 72-96 h; neutralize with 1 mol / L hydrochloric acid After concentrating to pH=7, add 3mL of methanol and 50mgPd / C to the reaction liquid, and stir at room temperature for 2h with hydrogen gas, then add 1mL of 10% LiOH aqueous solution, stir at room temperature for 5h, after concentrating, add 2mL of DMF, stir to dissolve; 0.12mmol of N,N'-carbonyldiimidazole was dissolved in 1mL of DMF, then added dropwise to the reaction solution, heated to reflux for 1h, filtered and purified to obtain imidazo[1,5-a]pyrido[2,3-E] pyrazinone.

[0046] 3-Fluoro-2-nitropyridine, CAS: 54231-35-5, was purchased from Hangzhou Jieheng Chemical Co....

Embodiment 1

[0099] Example 1 provides a high heat-resistant organic solder flux, which includes at least the following components in parts by weight: 1 part of aryl-substituted imidazole, 0.1 part of imidazopyridopyrazinone, 10 parts of formic acid, 50 parts of propionic acid 1 part, 10 parts of 2-(2-methoxyethoxy) acetic acid, 1 part of metal compound, and 1000 parts of deionized water.

[0100] The aryl-substituted imidazole is 4-methyl-2,5-diphenylimidazole.

[0101] The imidazopyridopyrazinone is imidazo[1,5-a]pyrido[2,3-E]pyrazinone.

[0102] The preparation method of the imidazo[1,5-a]pyrido[2,3-E]pyrazinone at least comprises the following steps:

[0103] Dissolve 0.1 mmol of 3-fluoro-2-nitropyridine and 0.1 mmol of imidazole in 10 mL of acetonitrile, add 0.4 mmol of potassium carbonate, stir at room temperature for 72-96 h; neutralize with 1 mol / L hydrochloric acid After concentrating to pH=7, add 3mL of methanol and 50mgPd / C to the reaction liquid, and stir at room temperature ...

Embodiment 2

[0109] Example 2 provides a high heat-resistant organic solder flux, which includes at least the following components in parts by weight: 3 parts of aryl-substituted imidazole, 0.1 part of imidazopyridopyrazinone, 10 parts of formic acid, and 100 parts of propionic acid 1 part, 10 parts of 2-(2-methoxyethoxy) acetic acid, 1 part of metal compound, and 1000 parts of deionized water.

[0110] The aryl-substituted imidazole is 4-methyl-2,5-diphenylimidazole.

[0111] The imidazopyridopyrazinone is imidazo[1,5-a]pyrido[2,3-E]pyrazinone.

[0112] The metal compound is cuprous chloride.

[0113] The preparation method of the high heat-resistant organic solder flux is the same as in Example 1.

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Abstract

The invention relates to a soldering preservative and in particular to a high heat resistance organic soldering preservative and application thereof. The high heat resistance organic soldering preservative at least comprises the following components in parts by weight: 1-6 parts of aryl substituted imidazole, 0.1-3 parts of imidazopyridine pyrazinone, 10-50 parts of formic acid, 50-100 parts of propionic acid, 10-50 parts of 2-(2-methoxy ethyoxyl) acetic acid, 1-6 parts of a metal compound and 1000 parts of deionized water.

Description

technical field [0001] The present invention relates to flux, in particular to a highly heat-resistant organic flux and its application. Background technique [0002] OSP is the abbreviation of Organic Solder-ability Preservatives, translated as organic solder protection film, also known as copper protection agent. To put it simply, OSP is to grow a layer of organic film chemically on the clean bare copper surface. Continue to rust (oxidation or vulcanization, etc.); but in the subsequent welding high temperature, this protective film must be easily removed by the flux quickly, so that the exposed clean copper surface can be melted in a very short time The solder immediately bonds into a strong solder joint. [0003] In fact, OSP is not a new technology, it has actually existed for more than 35 years. OSP has many benefits, such as good planarity, good wettability, allows direct welding of solder and copper during soldering (good wettability), can be processed at lower te...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362B23K101/42
CPCB23K35/3612B23K35/362
Inventor 张志恒
Owner WINSTAR CHEM SHANGHAI
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