Thick film resistor slurry with environmental protection function

A thick film resistor and film resistor technology, applied in the field of electronics, can solve problems such as environmental pollution, and achieve the effects of improving stability, good printability and wettability, and strong adhesion

Inactive Publication Date: 2018-04-24
SICHUAN QIXING ELECTRONICS
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to: aim at the phenomenon that the above-mentioned resistance paste contains harmful substances such as lead, and the ruthenium-based thick film resistance paste has been hovering at a lower level, resulting in environmental pollution, and the low resistance and high TCR of the thick film resistance paste There are contradictory problems among them, the present invention provides a kind of thick film resistor paste with environmental protection function

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A kind of thick-film resistance slurry with environmental protection function, the film resistance slurry comprises the following components in parts by mass: 1 part of high-temperature-resistant organic silicon polymer; RuO 2 10 parts of powder; 3 parts of Au powder; 2 parts of resin; 0.5 parts of aluminum stearate heat stabilizer; 1 part of high boiling point solvent; 3 parts of curing agent; 1 part of curing accelerator; 5 parts of glass powder;

[0023] The composition of the glass powder includes 30% SiO 2 , 20%Al 2 o 3 , 5% CaO, 15% BaO, 0% B 2 o 3 and 8% Bi 2 o 3 .

Embodiment 2

[0025] A kind of thick-film resistance slurry with environmental protection function, the film resistance slurry comprises the following components in parts by mass: 2 parts of high-temperature-resistant organic silicon polymer; RuO 2 11 parts of powder; 4 parts of Au powder; 2 parts of resin; 0.6 parts of aluminum stearate heat stabilizer; 2 parts of high boiling point solvent; 4 parts of curing agent; 1.1 parts of curing accelerator; 6 parts of glass powder;

[0026] The composition of the glass frit includes 35% SiO 2 , 25%Al 2 o 3 , 6% CaO, 16% BaO, 1% B 2 o 3 and 9% Bi 2 o 3 .

Embodiment 3

[0028] A kind of thick-film resistance slurry with environmental protection function, the film resistance slurry comprises the following components in parts by mass: 5 parts of high-temperature-resistant organic silicon polymer; RuO 2 15 parts of powder; 5 parts of Au powder; 3 parts of resin; 1 part of aluminum stearate heat stabilizer; 3 parts of high boiling point solvent; 6 parts of curing agent; 1.5 parts of curing accelerator; 10 parts of glass powder;

[0029] The composition of the glass frit includes 40% SiO 2 , 40% Al 2 o 3 , 8% CaO, 20% BaO, 5% B 2 o 3 and 12% Bi 2 o 3 .

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a thick-film resistor slurry with an environmental protection function. The film resistor slurry comprises the following components in parts by mass: 1-5 parts of high-temperature-resistant organosilicon polymer; 10-15 parts of RuO2 powder; Au 3-5 parts of powder; 2-3 parts of resin; 0.5-1 part of aluminum stearate heat stabilizer; 1-3 parts of high boiling point solvent; 3-6 parts of curing agent; 1-1.5 parts of curing accelerator; 5 parts of glass powder ‑10 parts, the preparation method of gold-doped modified ruthenium dioxide thick-film resistance slurry of the present invention solves the problem of contradiction between the low resistance and high TCR of existing thick-film resistance slurry, and the method has great impact on production process and equipment No special requirements, easy to promote and industrialized production, has the characteristics of low-temperature curing, high-temperature use, good printability and wettability, and strong adhesion to the substrate.

Description

technical field [0001] The invention relates to the field of electronics, in particular to a thick-film resistor paste with an environmental protection function. Background technique [0002] Thick film resistor paste is an electronic functional material integrating materials, chemical industry, metallurgy and electronic technology. It is the basic material for hybrid integrated circuits, surface mount technology, resistor networks, sensitive components and various discrete electronic components. The thick film resistors prepared by it have the characteristics of simple manufacture, excellent performance and strong stability, and are widely used in many fields such as aerospace, measurement and control systems, communication systems, medical equipment, hybrid integrated circuits and civilian electronic products. However, with the rapid development of integrated circuits and chips, current resistors have many shortcomings and cannot meet the needs of integration. Resistor pas...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01B1/20H01B1/22H01C7/00
CPCH01B1/20H01B1/22H01C7/003
Inventor 江明泓
Owner SICHUAN QIXING ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products