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Preparation method of high thermal conductivity ceramic aluminum-based copper clad laminate

A technology of aluminum-based copper-clad laminates and high thermal conductivity ceramics, applied in chemical instruments and methods, non-polymer adhesive additives, lamination, etc., can solve problems such as increasing the thickness of ceramic aluminum-based copper-clad laminates and increasing production costs, and achieve Excellent thermal conductivity and insulation performance, reduced thickness, and improved economic benefits

Inactive Publication Date: 2018-04-17
铜陵市东方矿冶机械有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method improves the heat conduction effect and pressure resistance, it is based on the premise of increasing the thickness of the ceramic aluminum-based copper-clad laminate and increasing the production cost, and the specific application still has certain limitations.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Embodiment 1: The preparation method of high thermal conductivity ceramic aluminum-based copper-clad laminate, which includes the following steps: (1), aluminum plate pretreatment: evenly coat a layer of composite paint with a thickness of 2mm on the aluminum plate and dry it at 220 ° C, The composite coating includes by weight: 10 parts of neutral silicone glue, 4 parts of castor oil polyoxyethylene ether and 4 parts of sodium petroleum sulfonate; (2), ceramic treatment of aluminum plate: uniform ceramic enamel with a spray gun Spray it on the aluminum plate, and then strengthen it at 350°C for 20 minutes to form a vitrified aluminum plate. The ceramic enamel includes by weight: 2 parts of alumina, 28 parts of silicon dioxide, 7 parts of titanium dioxide, 6 parts of boron oxide and 3 parts of Microcrystalline cellulose, the thickness of the enamel spraying is 2 μm; (3), coating the bonding layer: coating the bonding layer on the surface of the ceramicized aluminum plate...

Embodiment 2

[0012] Embodiment 2: The preparation method of high thermal conductivity ceramic aluminum-based copper-clad laminate, which includes the following steps: (1), aluminum plate pretreatment: evenly coat a layer of composite paint with a thickness of 3mm on the aluminum plate and dry it at 230 ° C, The composite coating includes by weight: 15 parts of neutral silicone glue, 5 parts of castor oil polyoxyethylene ether and 6 parts of sodium petroleum sulfonate; (2), ceramic treatment of aluminum plate: uniform ceramic enamel with spray gun Spray it on the aluminum plate, and then strengthen it at 360°C for 25 minutes to form a vitrified aluminum plate. The ceramic enamel includes by weight: 3 parts of alumina, 30 parts of silicon dioxide, 8 parts of titanium dioxide, 7 parts of boron oxide and 4 parts Microcrystalline cellulose, the thickness of the enamel spraying is 5 μm; (3), coating the bonding layer: coating the bonding layer on the surface of the ceramized aluminum plate, the b...

Embodiment 3

[0013] Embodiment 3: The preparation method of high thermal conductivity ceramic aluminum-based copper-clad laminate, which includes the following steps: (1), aluminum plate pretreatment: evenly coat a layer of composite paint with a thickness of 4mm on the aluminum plate and dry it at 240 ° C, The composite coating includes by weight: 20 parts of neutral silicone glue, 6 parts of castor oil polyoxyethylene ether and 8 parts of sodium petroleum sulfonate; (2), ceramic treatment of aluminum plate: use a spray gun to uniformly coat the ceramic enamel Spray it on the aluminum plate, and then strengthen it at 370°C for 30 minutes to form a vitrified aluminum plate. The ceramic enamel includes by weight: 4 parts of alumina, 33 parts of silicon dioxide, 10 parts of titanium dioxide, 8 parts of boron oxide and 5 parts Microcrystalline cellulose, the thickness of the enamel spraying is 8 μm; (3), coating the bonding layer: coating the bonding layer on the surface of the ceramicized alu...

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PUM

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Abstract

The invention discloses a preparation method of a high thermal conductivity ceramic aluminum-based copper clad laminate. The preparation method comprises the following steps: (1) carrying out aluminumplate pretreatment; (2) carrying out aluminum plate ceramization treatment; (3) coating a bonding layer; and (4) superimposing and carrying out hot pressing. The preparation method disclosed by the invention has the beneficial effects that firstly pretreatment is carried out on an aluminum plate, then ceramization treatment is carried out on the aluminum plate, the traditional preparation technology is subverted, the adopted composite coating has excellent heat conducting property and insulating property, the thickness of an insulating layer is reduced, production cost is reduced, and economic benefit is improved.

Description

technical field [0001] The invention relates to a preparation method of an aluminum-based copper-clad laminate, in particular to a preparation method of a ceramic aluminum-based copper-clad laminate. Background technique [0002] With the development of power electronics technology, the packaging direction of new power electronic devices adopts modularization, and the heat-conducting ceramic copper-clad laminate is the key material. while ceramics (AlN or Al 2 o 3 ) The production of copper clad laminates often adopts the direct copper clad method DBC process, which uses copper and cuprous oxide to produce Cu-Cu between 1064 ° C and 1083 ° C 2 The O eutectic liquid phase acts as a binder between the copper plate and the ceramic plate to bond the two together. The peeling strength of the laminated ceramic copper clad laminate is over 60N / cm, and has the advantages of good thermal conductivity, thermal shock resistance, high service temperature, etc., and is suitable for ch...

Claims

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Application Information

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IPC IPC(8): B32B37/06B32B37/08B32B37/10B32B37/12C03C8/20C09D183/04C09D7/65C09D7/63C09J175/04C09J11/04
CPCB32B37/1284B32B37/06B32B37/08B32B37/1009B32B2307/206B32B2307/302C03C8/20C08K2003/2206C08K2003/2244C08K2201/011C09D183/04C09J11/04C09J175/04C08L71/02C08K5/42
Inventor 侯世祥
Owner 铜陵市东方矿冶机械有限责任公司
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