Internal connection structure of semiconductor device and manufacturing method of internal connection structure
A technology of interconnect structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., and can solve problems such as interconnection crosstalk
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[0050] The interconnection structure and manufacturing method of the semiconductor device proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention. In addition, the structures shown in the drawings are often a part of the actual structures. In particular, each drawing needs to display different emphases, and sometimes uses different scales.
[0051] Specifically, please refer to Figure 1 to Figure 7 ,in, figure 1 is a schematic cross-sectional view of the substrate provided in the method for manufacturing the interconnection structure of the semiconductor device acc...
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