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Preparation method of flexible touch substrate and flexible touch substrate

A flexible touch and substrate technology, applied in the input/output process of data processing, instruments, electrical digital data processing, etc. rate and efficiency, the effect of increasing roughness

Active Publication Date: 2018-03-23
无锡品源知识产权顾问有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for preparing a flexible touch substrate and the flexible touch substrate, which solves the problem that the low release force release film is prone to misalignment during the preparation process, and at the same time realizes the easy peeling of the flexible touch substrate on the carrier substrate, improving the Yield and efficiency of flexible touch substrate release

Method used

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  • Preparation method of flexible touch substrate and flexible touch substrate
  • Preparation method of flexible touch substrate and flexible touch substrate
  • Preparation method of flexible touch substrate and flexible touch substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] figure 1 It is a flow chart of a method for preparing a flexible touch substrate provided in Embodiment 1 of the present invention, figure 2 It is a schematic cross-sectional view of the flexible touch substrate to be peeled off provided by Embodiment 1 of the present invention, image 3 It is a schematic cross-sectional view of the stripped flexible touch substrate provided by Embodiment 1 of the present invention. Wherein, the structure of the flexible touch substrate is a carrier substrate 21, a concave-convex release layer 22, a flexible substrate layer 23, and a touch function layer 24 in sequence. The preparation method of the flexible touch substrate specifically includes the following steps:

[0044] Step 110, forming a concave-convex release layer on the carrier substrate;

[0045] Wherein, the flexible touch screen needs to use a rigid carrier substrate 21 as a carrier during the manufacturing process, and the material of the carrier substrate 21 can be gla...

Embodiment 2

[0058] Figure 4 It is a flow chart of another method for preparing a flexible touch substrate provided in Embodiment 2 of the present invention, Figure 5 It is a schematic diagram of the V-groove carrier substrate provided in Embodiment 2 of the present invention, refer to Figure 4 , Figure 5 , wherein, S101, forming a concave-convex release layer on the carrier substrate may be S201, performing a concave-convex treatment on the carrier substrate, so that a concave-convex release layer is formed on one surface of the carrier substrate.

[0059] Among them, refer to Figure 5 The carrier substrate 21 itself can be subjected to a concave-convex treatment. The upper surface of the carrier substrate 21 forms a microscopic concave-convex structure through the concave-convex treatment. After the concave-convex treatment, the upper surface of the carrier substrate 21 forms a V-shaped groove-shaped concave-convex structure.

[0060] The technical solution of the embodiment of t...

Embodiment 3

[0066] Figure 8 It is a flow chart of another method for preparing a flexible touch substrate provided in Embodiment 3 of the present invention, Figure 9 It is a schematic diagram of a V-shaped groove-shaped concave-convex release layer provided in Embodiment 3 of the present invention, wherein, S101, forming a concave-convex release layer on a carrier substrate may be S301, coating a low-release force material on a carrier substrate to form a release film , Carry out concave-convex treatment on the release film to form a concave-convex release layer.

[0067] Among them, the low release force means that the surface adhesion is low, and it is easier to peel off later, and coating the low release force material on the carrier substrate 21 can ensure that the flexible substrate layer on it is easier to peel off, and the surface is processed by embossing. As for the release film, the concave-convex release layer 22 shown in reference 8 is formed. Optionally, the low release f...

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Abstract

The invention discloses a preparation method of a flexible touch substrate and the flexible touch substrate. The method comprises the steps that a concave-convex release layer is formed on a carrier substrate; a flexible substrate layer is formed on the concave-convex release layer; a touch functional layer is formed on the flexible substrate layer; and the flexible substrate layer and the touch functional layer are stripped from the carrier substrate. According to the method, the concave-convex release layer is arranged on the carrier substrate, the roughness between the flexible substrate layer and the carrier substrate can be enhanced, dislocation and disengagement of the flexible substrate layer are prevented, it is guaranteed that the flexible touch substrate is stably fixed to the carrier substrate at a preparation stage, the flexible touch substrate can be conveniently stripped at a stripping stage, damage to the touch substrate in the striping process is avoided, and the yieldand efficiency of flexible touch substrate release are improved.

Description

technical field [0001] Embodiments of the present invention relate to touch display technology, and in particular to a method for preparing a flexible touch substrate and the flexible touch substrate. Background technique [0002] In the mobile Internet era, the application of flexible touch screens on mobile phones, the Internet of Things and wearable devices will bring about a new revolution in consumer experience. [0003] At present, most of the preparation methods of flexible touch screens have the same thing, that is, the flexible substrate layer and the touch device need to be sequentially prepared on the carrier substrate, and then the prepared flexible touch screen is peeled off from the carrier substrate by laser peeling or mechanical peeling. [0004] In order to reduce production costs and improve production efficiency, the peeling of flexible touch substrates usually adopts a mechanical peeling method. However, when a release film with high adhesion is used, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041
CPCG06F3/041G06F2203/04102G06F2203/04103
Inventor 杨晓艳
Owner 无锡品源知识产权顾问有限公司
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