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High-sensitivity microphone and manufacturing method thereof

A high-sensitivity, microphone technology, applied in the manufacture of microstructure devices, semiconductor electrostatic transducers, loudspeakers, etc., can solve the problems of the vibrating membrane 3 not being fixed, not easy to adjust the stiffness, and poor durability

Active Publication Date: 2021-06-15
HYUNDAI MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] However, when the related art microphone is not driven, the vibrating membrane 3 is not fixed and free between the substrate 1 and the fixed membrane 2, and therefore, the vibrating membrane 3 may be damaged due to impact
[0016] Durability may be deteriorated due to stress caused when the diaphragm 3 repeatedly contacts or is spaced from the fixed diaphragm 2 and pillar 4 depending on the driving / non-driving of the microphone
[0017] In addition, it is not easy to adjust the stiffness due to the clamp structure (where the diaphragm 3 is fixed to the rigid post 4 when driving the microphone), making it difficult to additionally increase the sensitivity

Method used

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  • High-sensitivity microphone and manufacturing method thereof
  • High-sensitivity microphone and manufacturing method thereof
  • High-sensitivity microphone and manufacturing method thereof

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Embodiment Construction

[0044] In the following detailed description, only certain example embodiments of the present disclosure have been shown and described, simply by way of illustration. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive. The same reference numerals denote the same elements throughout the specification.

[0045] In the specification, unless expressly stated to the contrary, the word "comprise" and variations such as "comprises" or "comprising" will be understood to mean that the stated elements are included, but not Exclude any other components. In addition, the terms "... device (-er)", "... device (-or)", and "module" described in the specification mean a unit for processing at least one function and operation, and can be implemented by ...

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Abstract

The present application relates to a high-sensitivity microphone and a manufacturing method thereof. The high-sensitivity microphone includes: a substrate having a penetrating portion disposed in its central portion; a vibrating membrane disposed on the substrate and covering the penetrating portion; a fixed membrane mounted above the vibrating membrane through a The air layer in between is separated from the vibrating membrane, and the fixed membrane has a plurality of air inlets perforated in the direction toward the air layer; posts, and mechanically fixes the diaphragm by friction regardless of the applied voltage.

Description

[0001] Related Application Cross Reference [0002] This application claims priority from Korean Patent Application No. 10-2016-0116721 filed September 9, 2016, the entire contents of which are hereby incorporated by reference. technical field [0003] The present disclosure relates to a high-sensitivity microphone and a manufacturing method thereof. Background technique [0004] In general, a microphone refers to a device that converts sound, such as nearby voice, into an electrical signal and processes the electrical signal into a signal that enables a person or machine to eventually recognize the sound. [0005] As microphones that convert audio signals into electrical signals, condenser microphones and piezoelectric microphones have been developed. [0006] A condenser microphone includes a microelectrochemical system (MEMS) in which a fixed membrane and a vibrating membrane are separated from each other. In MEMS, when a sound pressure is applied to a vibrating membran...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04H04R31/00H04R2201/003H04R2231/003H04R19/005H04R31/003H10K85/221H04R19/016B81B3/0075B81B2201/0257B81B2203/0127B81C1/00158B81C2201/0109B81C2201/013
Inventor 俞一善
Owner HYUNDAI MOTOR CO LTD
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