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Discrete double-rectangle gate-controlled U-shaped channel source-drain double tunnelling transistor and manufacturing method thereof

A technique of tunneling transistors and rectangular gates, which is applied in the field of discrete double rectangular gate-controlled U-shaped channel source-drain double tunneling transistors and its manufacturing, which can solve the problems of one-way switching and subthreshold swing cannot be reduced.

Active Publication Date: 2018-02-23
宿松新驱光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to effectively combine and utilize the advantages of interchangeable source and drain of MOSFETs type devices and the low subthreshold swing swing of ordinary tunneling field effect transistors, solve the problem that the subthreshold swing of MOSFETs type devices cannot be reduced and ordinary tunneling field effect transistors It can only be used as a one-way switch, and the present invention proposes a discrete double rectangular gate-controlled U-shaped channel source-drain double tunneling transistor and its manufacturing method

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  • Discrete double-rectangle gate-controlled U-shaped channel source-drain double tunnelling transistor and manufacturing method thereof
  • Discrete double-rectangle gate-controlled U-shaped channel source-drain double tunnelling transistor and manufacturing method thereof
  • Discrete double-rectangle gate-controlled U-shaped channel source-drain double tunnelling transistor and manufacturing method thereof

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Embodiment Construction

[0064] The present invention will be further described below in conjunction with the accompanying drawings:

[0065] like figure 1 , figure 2 and image 3 As shown, a discrete double rectangular gate-controlled U-channel source-drain double tunneling transistor includes a silicon substrate 12 of an SOI wafer, and above the silicon substrate 12 of the SOI wafer is a substrate insulating layer 11 of the SOI wafer , above the substrate insulating layer 11 of the SOI wafer is a partial area of ​​the single crystal silicon film 1, the rectangular barrier control gate 2 and the insulating dielectric barrier layer 13; wherein, the single crystal silicon film 1 is an impurity concentration lower than 10 16 cm -3 The single crystal silicon semiconductor material has the characteristics of a U-shaped groove structure; the outer sides of the vertical parts on the left and right sides of the U-shaped groove structure formed by the single crystal silicon film 1 are the gate electrode i...

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Abstract

The invention relates to a discrete double-rectangle gate-controlled U-shaped channel source-drain double tunnelling transistor and a manufacturing method thereof. The transistor has the rectangular gate electrode structure characteristic capable of making two sides of a source and a drain of the transistor generate the tunnelling effect at the same time and the bilaterally symmetric structure characteristic capable of achieving source-drain interchangeable two-way conduction, and a rectangular gate electrode forms three-side wrapping on vertical parts at two sides of a monocrystalline siliconfilm, so that the transistor provided by the invention has relatively high gate-controlled ability, can achieve the low subthreshold swing characteristic, and has the barrier control gate structure characteristic capable of preventing a majority carrier of a source-drain doped region from flowing through the transistor. Compared with ordinary MOSFETs, the discrete double-rectangle gate-controlledU-shaped channel source-drain double tunnelling transistor has the advantage that more excellent switching characteristic is achieved by using the tunnelling effect; and compared with an ordinary tunnelling field effect transistor, the discrete double-rectangle gate-controlled U-shaped channel source-drain double tunnelling transistor has the source-drain symmetric interchangeable two-way switching characteristic that the ordinary tunnelling field effect transistor does not have, therefore, the discrete double-rectangle gate-controlled U-shaped channel source-drain double tunnelling transistor is suitable for promotion and application.

Description

technical field [0001] The invention relates to the field of ultra-large-scale integrated circuit manufacturing, in particular to a discrete double-rectangular gate-controlled U-channel source-drain double tunneling transistor with low leakage current suitable for the manufacture of low-power integrated circuits and a manufacturing method thereof. Background technique [0002] According to the requirements of Moore's Law, the size of MOSFETs, the basic unit of integrated circuits, will become smaller and smaller, which will not only deepen the difficulty of the manufacturing process, but also become more and more prominent in various adverse effects. The MOSFETs type devices used in integrated circuit design today are limited by the physical mechanism of their own current generation during operation, and their sub-threshold swing cannot be lower than 60mV / dec. When an ordinary tunneling field effect transistor is used as a switching device, the tunneling effect of carriers b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/739H01L29/423H01L21/331
Inventor 靳晓诗高云翔刘溪
Owner 宿松新驱光电科技有限公司
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