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A rectangular gate-controlled u-shaped channel bidirectional switch tunneling transistor and its manufacturing method

A technology of tunneling transistors and bidirectional switches, applied in transistors, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problem that ordinary tunneling field effect transistors can only be used as unidirectional switches, and the sub-threshold swing of MOSFETs type devices cannot be reduced. And other issues

Active Publication Date: 2019-10-15
宿松新驱光电科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to effectively combine and utilize the advantages of interchangeable source and drain of MOSFETs type devices and the low subthreshold swing swing of ordinary tunneling field effect transistors, solve the problem that the subthreshold swing of MOSFETs type devices cannot be reduced and ordinary tunneling field effect transistors It can only be used as a one-way switch, and the present invention proposes a rectangular gate-controlled U-shaped channel bidirectional switch tunneling transistor and its manufacturing method

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  • A rectangular gate-controlled u-shaped channel bidirectional switch tunneling transistor and its manufacturing method
  • A rectangular gate-controlled u-shaped channel bidirectional switch tunneling transistor and its manufacturing method
  • A rectangular gate-controlled u-shaped channel bidirectional switch tunneling transistor and its manufacturing method

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Embodiment Construction

[0066] Below in conjunction with accompanying drawing, the present invention will be further described:

[0067] Such as figure 1 , figure 2 and image 3 As shown, a rectangular gate-controlled U-shaped channel bidirectional switch tunneling transistor includes a silicon substrate 12 of an SOI wafer, and is characterized in that: the silicon substrate 12 of the SOI wafer is above the substrate insulating layer of the SOI wafer 11. Above the substrate insulating layer 11 of the SOI wafer is a single crystal silicon film 1, a first-type impurity heavily doped region 2 and a part of the insulating dielectric barrier layer 13; wherein, the single crystal silicon film 1 has a low impurity concentration at 10 16 cm -3 The single crystal silicon semiconductor material; the first type of impurity heavily doped region 2 is located in the middle part of the bottom of the single crystal silicon film 1, and the conductivity type of the doped impurity determines the conduction type of...

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Abstract

The invention relates to a rectangular grid-control U-shaped channel bilateral switch tunneling transistor and a manufacturing method thereof. The device is provided with a rectangular grid and a symmetrical structural feature and has relatively high grid control capacity, and a heavily-doped source drain interchangeable region of second type of impurities can be controlled as a source region or adrain region by adjusting source drain interchangeable electrode voltage, so that the tunneling current direction is changed. The transistor has the advantages of low static power consumption, reverse leakage current, relatively high grid control capacity, low subthreshold amplitude and achievement of bilateral switch function. Compared with an ordinary MOSFETs type device, a preferable switchingcharacteristic is realized by using a tunneling effect; and compared with an ordinary tunneling filed effect transistor, the transistor has a source drain interchangeable bidirectionally symmetricalswitching characteristic that the ordinary tunneling filed effect transistor does not own, so that the transistor is applicable for popularization and application.

Description

technical field [0001] The invention relates to the field of ultra-large-scale integrated circuit manufacturing, in particular to a rectangular gate-controlled U-shaped channel bidirectional switch tunneling transistor with low leakage current suitable for low-power integrated circuit manufacturing and a manufacturing method thereof. Background technique [0002] According to the requirements of Moore's law, the basic unit MOSFETs of integrated circuits will become smaller and smaller in size, which will not only increase the difficulty of the manufacturing process, but also cause various adverse effects to become more prominent. Due to the limitation of the physical mechanism of current generation of MOSFETs used in integrated circuit design, the subthreshold swing cannot be lower than 60mV / dec. When the ordinary tunneling field effect transistor is used as a switching device, the tunneling effect of carriers between the semiconductor energy bands is used as the conduction ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/73H01L29/10H01L21/336
Inventor 靳晓诗高云翔刘溪
Owner 宿松新驱光电科技有限公司
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