Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Dynamic processor adjustment method and device and processor chip

A dynamic adjustment and processor technology, applied in multi-programming devices, electrical digital data processing, instruments, etc., can solve the problems of poor effectiveness of balanced processors, incomplete evaluation of working status, etc., and achieve the effect of balancing performance and power consumption

Active Publication Date: 2018-02-09
CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST
View PDF5 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a processor dynamic adjustment method for the incomplete evaluation of the current processor's working status, which results in poor effectiveness in balancing processor performance and power consumption. Adjustment method and device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dynamic processor adjustment method and device and processor chip
  • Dynamic processor adjustment method and device and processor chip
  • Dynamic processor adjustment method and device and processor chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0050] A Spec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses dynamic processor adjustment method and device and a processor chip. Multi-direction processor information can be combined for dynamic adjustment; maximum working frequency isobtained through current working status data of a processor; An expectation task amount is combined to obtain a task amount evaluation parameter, and then weighting task amount parameters are obtained; optimal working frequency is obtained through comparing the task amount evaluation parameter with the weighting task amount parameters; and the optimal working frequency is written into the processor to realize frequency adjustment. Various sensors are utilized to collect different sensor information, a current working condition of the processor is acquired, dynamic workload status of the processor is combined to comprehensively evaluate current working status of the processor, composite status reflecting multi-aspect information of the processor is utilized to dynamically adjust working frequency and voltage of the processor, and thus performance and power consumption of the processor are better balanced.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to a processor dynamic adjustment method, device and processor chip. Background technique [0002] With the continuous improvement of the level of integrated circuit technology, the scale of integrated circuits is also rapidly increasing at a rate of doubling every one and a half years under the guidance of Moore's Law. From single-function chips to system-on-chips, and toward the direction of on-chip networked chips. Higher performance is the constant goal of high-end integrated circuit development. For a chip with a certain architecture, increasing the operating frequency can greatly improve the performance of the chip. However, the operating frequency of the chip is affected by many factors. For commercial products, the final maximum operating frequency is often determined by the short board in the batch of chips, that is, it is uniformly determined by the frequency of the l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F9/50
CPCG06F9/5094Y02D10/00
Inventor 雷登云陆裕东成立业俞鹏飞恩云飞黄云
Owner CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products