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Microchannel liquid cooling cold plate

A micro-channel and channel fluid technology, applied in the field of electronic information, can solve the problems of long manufacturing cycle, complex process, inconvenient sealing, etc., and achieve the effect of increasing the degree of turbulence, reducing the thickness of the boundary layer, and shortening the research and development cycle.

Active Publication Date: 2018-02-09
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Secondly, in terms of technology, the current processing of liquid-cooled cold plates mainly adopts split manufacturing, that is, after the flow channel is processed on the base plate, it is welded or bolted to the cover plate, which often has inconvenient sealing and the risk of liquid leakage , and the process is complex and the manufacturing cycle is long

Method used

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  • Microchannel liquid cooling cold plate
  • Microchannel liquid cooling cold plate

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:

[0025] Such as figure 1 and figure 2 As shown, a kind of micro-channel liquid-cooled cold plate provided by the present invention comprises a cold plate base 1, and the inside of the cold plate base 1 is provided with an internal flow channel 2, and the internal flow channel 2 includes a flow channel inlet 21, a flow channel outlet 22 and at least A microchannel unit 23, the microchannel unit 23 communicates with the flow channel inlet 21 and the flow channel outlet 22 respectively, the cooling liquid enters from the flow channel inlet 21, and flows out from the flow channel outlet 22 after passing through the microchannel unit 23, the microchannel unit 23 The horizontal section is butterfly-shaped, and the flow channel inlet 21 and the flow channel outlet 22 communicate with the external environment respectively.

[0026] The microchannel unit 23...

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Abstract

The invention discloses a microchannel liquid cooling cold plate which comprises a cold plate base body, wherein an internal channel is formed in the cold plate base body and comprises a channel inlet, a channel outlet and at least one microchannel unit; the microchannel unit communicates with the channel inlet and the channel outlet; cooling liquid enters from the channel inlet, passes through the microchannel unit and flows out of the channel outlet; the horizontal cross section of the microchannel unit is butterfly-shaped; and the channel inlet and the channel outlet communicate with the external environment. The microchannel liquid cooling cold plate is designed by adopting bionics, imitates a butterfly wing microchannel unit, changes the flowing direction and manner of cooling liquidand increases the turbulent flow degree through reasonable flow distribution, reduces the thickness of a boundary layer, and improves and intensifies the thermal homogeneity and the heat exchanging efficiency of a heated surface.

Description

technical field [0001] The invention belongs to the technical field of electronic information, and in particular relates to a microchannel liquid-cooled cold plate. Background technique [0002] With the improvement of the integration of electronic equipment, a large number of regularly arranged components are arranged in a limited space, and the heat flux density reaches the level of hundreds of watts. The micro-channel liquid-cooled cold plate has the advantages of small size, high heat dissipation performance, and light weight. It is currently a commonly used heat dissipation method to solve the problem of high heat flux density. [0003] The deficiencies in the design and process of the microchannel liquid-cooled cold plate have affected its application and development in the field of heat dissipation for electronic heat dissipation equipment. [0004] First of all, in terms of design, since Tucherman et al. proposed the micro-channel heat dissipation technology, they h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/00F28F21/08H05K7/20
CPCF28D15/00F28F21/084H05K7/20
Inventor 杜平安谭慧陈加进王明阳
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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