Method for manufacturing circuit board

Abstract

The invention discloses a method for manufacturing a circuit board. The method comprises the following steps: carrying out rough shape cutting on a PCB material; carrying out primary hole drilling; carrying out plated-through-hole processing; carrying out whole-board electroplating processing; carrying out first-time pattern transferring, carrying out copper thickening; carrying out resin hole plugging; carrying out resin grinding; carrying out film removing; carrying out second-time pattern transferring; carrying out flash gold processing; carrying out third-time pattern transferring; carrying out electric thick soft gold processing; carrying out secondary hole drilling; carrying out film removing; and carrying out outer-layer line etching. According to the invention, selective electroplating is carried out by two-times line transferring, so that the local copper thickness request is met. With the resin hole plugging and the third-time pattern transferring, requirements of plugged hole evenness and fullness from the client are met; and the line is bound with the PAD electric thick soft gold partially, so that application of the special function is realized.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a circuit board. Background technique [0002] CS often represents the front (Top) side of the outermost layer, and the reverse side of the outermost layer is generally represented by SS. [0003] With the rapid development of informatization, electronic products are developing towards diversified functions and portable functions. Fine lines, micro-holes and high density have become common phenomena, and some printed circuit boards with special structures have appeared. For example, customers require some high-frequency The copper thickness of the finished product in the local area of ​​the board is required to be Hoz, and the copper thickness of the finished product in the local area is required to be 1oz. The thickness of the bottom copper has both Hoz and 1oz; The degree of hole is flat and full; the surface treatment requirement is...

AI Technical Summary

Problems solved by technology

[0003] With the rapid development of informatization, electronic products are developing towards diversified functions and portable functions. Fine lines, micro-holes and high density have become common phenomena, and some printed circuit boards with special structures have appeared. For example, customers require some high-frequency The copper thickness of the finished product in the local area of ​​the board is required to be Hoz, and the copper thickness of the finished product in the local area is required to be 1oz. The thickness of the bottom copper has both Hoz and 1oz; The degree of hole is flat and full; the surface treatment requirement is electro-gold and part of the binding PAD is required to be electro-thick soft gold, but the production process in the prior art can only control the thickness of the entire surface of copper, which cannot meet the special surface copper at local positions. Requirements; via holes with single-sided and double-sided windows for solder resist, normal solder resist plug holes cannot meet customer requirements, resulting in the lack of special functions of some circuit boards

Images