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Cooling device

A technology of a heat sink and a liquid inlet, which is applied in the field of computers and can solve the problems of no solution and inability to work at the same time.

Active Publication Date: 2018-02-02
SUGON DATAENERGYBEIJING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, currently on the market, liquid level monitoring and adjustment are two independent devices that cannot work at the same time. Therefore, it takes a certain amount of time to complete the monitoring and adjustment process, and a relatively short period of time in a small space will cause a large liquid level change.
[0007] For the above-mentioned problems in related technologies, no effective solution has been proposed yet

Method used

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  • Cooling device

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0024] According to an embodiment of the present invention, a heat dissipation device is provided.

[0025] Such as figure 1 As shown, the heat dissipation device 100 according to the embodiment of the present invention includes: a cavity 10 with a refrigerant in the cavity 10 and a gas phase region above the liquid surface 30 of the refrigerant, and the device to be cooled is immersed in the refrigerant; the cavity 10 The side wall of the gas phase area is provided with a liquid inlet 40; t...

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Abstract

The invention discloses a cooling device, which comprises a cavity and a mechanical liquid level switch, wherein the cavity is full of refrigerating fluid, a gaseous phase area is arranged above the liquid level of the refrigerating fluid, and a device to be cooled is dipped in the refrigerating fluid; the side wall, which is positioned in the gaseous phase area, of the cavity is provided with a liquid inlet; the mechanical liquid level switch comprises a floater, a connecting rod and a baffle, wherein the floater is connected with the baffle through the connecting rod; the floater is positioned on the liquid level, and the baffle is used for regulating the opening degree of the liquid inlet; and the floater tracts the height of the baffle to change according to the change of liquid levelheight so as to regulate the flow of the refrigerating fluid of the liquid inlet. By use of the cooling device, the mechanical liquid level switch which comprises the floater, the connecting rod and the baffle is arranged on the liquid level of the refrigerating fluid, the opening degree of the liquid inlet is regulated through the baffle according to the liquid level height of the refrigerating fluid, the liquid level of the refrigerating fluid can be simultaneously monitored, and the liquid feeding amount of the refrigerating fluid is regulated.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a heat dissipation device. Background technique [0002] Most of the computers currently in use rely on cold air to cool down the machine, but in data centers, air cooling alone is not enough to meet the heat dissipation requirements of high heat flux density servers. The traditional air-cooling mode adopts the indirect contact cooling method. The heat transfer process is complicated, and there are contact thermal resistance and convective heat transfer thermal resistance. The total thermal resistance is large, and the heat transfer efficiency is low. Larger, requires a lower outdoor low-temperature heat source to guide the heat exchange process. [0003] Liquid cooling is to use the working fluid as the intermediate heat transfer medium to transfer the heat from the hot zone to the distant place for cooling. Since the specific heat of liquid is much greater than that of air,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 苗绪虎彭晶楠王晨吴宏杰李星孙振顾文峰宋景亮陈进
Owner SUGON DATAENERGYBEIJING CO LTD
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