A kind of copper sulfate electroplating liquid, its preparation method and application and electrolyzer

Abstract

The invention discloses a copper sulfate electroplating solution, its preparation method and application, and an electrolytic cell. The preparation method comprises the following steps: carrying out an electrolysis reaction in an electrolytic cell; the electrolyte solution of the electrolysis is an aqueous sulfuric acid solution, and the concentration of the aqueous sulfuric acid solution is 1mol / L-3mol / L; the current density of the electrolyte solution is 9 ‑10ASD. The electrolytic cell is provided with an anode, a cathode, a cation exchange membrane and a proton exchange membrane. The preparation method of the present invention has no traditional evaporative recrystallization chemical process, no waste gas and waste water discharge, is environmentally friendly, has a simple production process, and the prepared copper sulfate electroplating solution has high purity, controllable and reliable quality, and can be used in the field of semiconductor manufacturing and packaging. Applications in copper interconnect plating.

Description

technical field [0001] The invention relates to a copper sulfate electroplating solution, its preparation method and application and an electrolytic cell. Background technique [0002] At present, in the integrated circuit process, Damascus copper interconnection technology is widely used. Copper deposition technology is the key technology in Damascus copper interconnection technology. Whether the copper deposited in the micro-groove (hole) is dense, whether there are voids or cracks, directly affects the copper. The resistivity and anti-migration performance of the interconnection wire, and the key semiconductor material to realize the Damascus copper interconnection technology is the high-purity copper sulfate electroplating solution. The purity index of this product is very high, otherwise the reliability of the copper wiring will be affected. At present, most of the methods for producing ultra-clean and high-purity copper interconnect copper sulfate electroplating soluti...

AI Technical Summary

Problems solved by technology

This method has a long process route and high requirements on the quality of raw materials, and the fluctuation of the metal impurity content in the raw materials cannot be controlled. After the reaction, it is necessary to remove H 2 o 2 or HNO 3 , there is waste gas and wastewater discharge, pollutes the environment, and the production cost is high. For the line width design below 65nm, it is difficult to guarantee reliability

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