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Circuit board component separation equipment and utilization method thereof

A technology for separating equipment and components, used in welding equipment, metal processing equipment, auxiliary devices, etc., to achieve the effect of fast speed, sufficient separation, and classification and recycling

Pending Publication Date: 2018-01-26
金小强
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

At present, in the processing of electronic waste, there is a problem that cannot be effectively solved, that is, how to realize the efficient separation of components from the circuit board, and the separated components are not damaged and can continue to be used

Method used

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  • Circuit board component separation equipment and utilization method thereof

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Embodiment Construction

[0025] See attached figure 1 It is an embodiment of the present invention.

[0026] A circuit board component separation device, comprising a separation body 6 and a recovery bin body located above the separation body 6, the separation body 6 is respectively provided with a component storage room 12, a tin container 13, a drive mechanism, Heating temperature control mechanism and control system, the interior of the recovery bin 16 is respectively provided with a cylindrical first metal mesh 15 and a second metal mesh 14 from the inside to the outside, and the mesh diameter of the first metal mesh 15 is larger than the Describe the second metal mesh 14, the inner side of the first metal mesh 15 is used as the raw material bin 2, and the waste solid channel and the condensation pipe are respectively arranged under the raw material bin 2, and the condensation recovery device 11 is connected to the condensation pipe. A metal mesh 15 and the second metal mesh 14 are used as a comp...

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Abstract

The invention discloses circuit board component separation equipment. The circuit board component separation equipment comprises a separation body and a recovery bin body arranged above the separationbody. A component containing chamber, a tin-containing container, a driving mechanism, a heating and temperature controlling mechanism and a control system are arranged in the separation body. A first metal mesh and a second metal mesh which are in cylindrical shapes are arranged in the recovery bin body from inside to outside, the mesh diameter of the first metal mesh is larger than that of thesecond metal mesh, the inner side of the first metal mesh serves as a raw material bin, the position between the first metal mesh and the second metal mesh serves as a component recovery bin, and theposition between the second metal mesh and the outer wall of the recovery bin body serves as a tin recovery bin. Compared with the prior art, the circuit board component separation equipment and a utilization method thereof have the advantages of being free of pollution, high in speed, sufficient in separation, capable of achieving sorted recovery of organics and metal materials and the like, andare advanced equipment and method worthy of being popularized.

Description

technical field [0001] The invention relates to the technical field of recycling circuit board components, in particular to a circuit board component separation device and a method for using the same. Background technique [0002] The rapid development of the electronic industry and the widespread use of electronic equipment have brought about great changes in human production and lifestyles. However, due to the ineffective disposal of waste electronic equipment, serious environmental pollution problems have also arisen. Especially in recent years, the degree of national informatization has been rapidly improved, followed by the continuous shortening of the replacement cycle of electronic products, and the number of waste electronic products is also increasing day by day, so the recycling of electronic waste has become the current urgent issues to be resolved. At present, in the processing of electronic waste, there is a problem that has not been effectively solved, that is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00B23K3/08B23K1/018
Inventor 金小强程晓孙震任书明
Owner 金小强
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