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A silicon microphone and mobile terminal

A technology of silicon microphone and memory alloy, which is applied in the field of communication and can solve problems such as the silicon diaphragm is easy to break

Active Publication Date: 2019-04-12
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a silicon microphone and a mobile terminal to solve the problem that the silicon diaphragm of the existing silicon microphone is easily broken under the impact of high-intensity sound pressure

Method used

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  • A silicon microphone and mobile terminal
  • A silicon microphone and mobile terminal
  • A silicon microphone and mobile terminal

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Embodiment Construction

[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0017] See Figure 1-3 , figure 1 Is one of the structural schematic diagrams of the silicon microphone provided by the embodiment of the present invention; figure 2 Is the second structural diagram of the silicon microphone provided by the embodiment of the present invention; image 3 It is a schematic structural diagram of a plugging structure provided by an embodiment of the present invention.

[0018] Such as figure 1 with figure 2 As shown, the embodiment...

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Abstract

The invention provides a silicon microphone and a mobile terminal. The silicon microphone comprises a circuit board, a microelectromechnical system MEMS chip, a detecting and control module and a shell, wherein the shell is fixedly connected with one side of the circuit board to form accommodating space; the MEMS chip and the detecting and control module are arranged on the circuit board and are positioned in the accommodating space; a pickup hole is formed in the circuit board and corresponds to the MEMS chip; the circuit board is further provided with a blocking structure capable of closingor opening the pickup hole; the detecting and control module is used for detecting air pressure change parameter; and when a detected air pressure change parameter meets a first preset condition, theblocking structure is controlled to close the pickup hole. When high-strength air pressure impact is detected, the blocking structure is controlled to close the pickup hole, therefore, an air flow channel is stopped, a silicon vibrating diaphragm of the MEMS chip is protected against being impact by strong air flow of the outside, and the circumstance that the silicon microphone fails due to breakage of the silicon vibrating film is avoided.

Description

Technical field [0001] The present invention relates to the field of communication technology, in particular to a silicon microphone and a mobile terminal. Background technique [0002] With the development of social economy, people's living standards are getting higher and higher, and microphones have been widely used in mobile terminals such as smart phones, portable media players, digital cameras, and notebook computers in the consumer field. Among them, silicon microphones are also widely used in the above-mentioned mobile terminals due to their small size, strong stability, and reflow solderability. [0003] The silicon microphone includes a MEMS (Micro Electro Mechanical System) chip, and the MEMS chip includes a silicon diaphragm and a silicon back plate. Among them, the working principle of the MEMS chip is to use the pressure gradient generated by the sound change to cause the silicon diaphragm to be deformed by the sound pressure interference, and then to change the capa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04
Inventor 彭武
Owner VIVO MOBILE COMM CO LTD
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