A kind of manufacturing method of conductive PCM board

A manufacturing method and a technology of a substrate, which are applied in the manufacture of printed circuits, removal of conductive materials through light, printed circuits, etc., can solve problems such as inability to achieve partial conduction, and achieve high removal efficiency

Active Publication Date: 2020-07-24
青岛河钢复合新材料科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a method for making a conductive PCM board, which solves the problem that the method for making a conductive PCM board in the prior art cannot realize local conduction in any area

Method used

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Examples

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Embodiment Construction

[0022] The technical solution of the present invention will be further described in detail below in conjunction with specific embodiments. The present invention proposes an embodiment of a method for manufacturing a conductive PCM board. This conductive PCM board can be applied to the two-in-one inner lining board and backboard of a TV. In the backplane structure of the TV, in order to simplify the module, the inner lining board and the backplane are combined into one. In order to achieve the EMI index of the TV, the backplane of the appearance needs to be able to conduct electricity. The production of the conductive PCM board in this embodiment can meet the use requirements of the TV back panel, and realize that the front and back sides of the TV back panel can realize the conductive function at the same time. The specific steps of the manufacturing method of its corresponding conductive PCM board are as follows:

[0023] 1) Substrate pre-treatment: The substrate is first deg...

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Abstract

The invention provides a method of manufacturing a conductive PCM plate, which comprises the following steps: (1) substrate pretreatment: degreasing a substrate through a degreasing tank I and a degreasing tank II, washing the substrate through a washing process, and passivating the substrate; (2) front paint layer applying: coating the substrate after pretreatment with a front paint layer in a coating room, drying the front paint layer in an oven, and curing the front paint layer; (3) back conductive back paint applying: coating the passivated substrate with conductive back paint in the coating room, and drying the conductive back paint in the oven; (4) rolling and cutting: rolling up a roll material, and cutting the roll material into corresponding material pieces of fixed length according to the material requirement; (5) paint layer removing: removing the finishing paint layer and priming paint layer on the front by laser; and (6) protective film applying: cleaning up powder and impurities caused by laser, and applying a corresponding protective film according to the surface property of the coating. Through the method, the problem that local conduction in any area cannot be realized through the conductive PCM plate manufacturing method in the prior art is solved.

Description

technical field [0001] The invention relates to a manufacturing method of a conductive PCM board. Background technique [0002] The existing conductive PCM boards are generally manufactured by galvanized substrates and then sprayed with powder or roll-coated with PCM sheets or film-coated VCM sheets to achieve surface conductivity. , after powder spraying, it is removed by cleaning treatment, and the conductive area is leaked to realize conduction. The efficiency of this method is not high, and the operation is inconvenient and low in efficiency; The appearance is richer and more environmentally friendly. In the roller coating process, a part of the coating roller is scraped off so that the substrate layer is exposed on the surface to achieve electrical conductivity, but only vertical strips can be conductive, and local electrical conductivity cannot be achieved, that is, roller coating valve Due to the constraints of the roll coating process, the coating surface cannot ach...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/02
CPCH05K3/027H05K2203/107
Inventor 殷浩谢德胜陆日勇管丽娜
Owner 青岛河钢复合新材料科技有限公司
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