Low-dielectric constant high-quality factor LTCC microwave medium material and preparation method thereof

Abstract

The invention provides a low-dielectric constant high-quality factor LTCC microwave medium material and a preparation method thereof. The material comprises MgAl2O4 ceramic and MgAl2O4 ceramic composite sintering reducer, the MgAl2O4 ceramic is formed by pre-burning MgO and Al2O3; the composite sintering reducer is pre-burned by Li2CO3, H3BO3, SiO2, ZnO, and MgO to form Li2O-MgO-ZnO-B2O3-SiO2 glass, and the pre-burned MgAl2O4 ceramic and the Li2O-MgO-ZnO-B2O3-SiO2 glass are subjected to ball milling mixing according the mass ratio of 1:2, granulation, moulding, rubber discharging and sintering to prepare the low-dielectric constant high-quality factor LTCC microwave medium material. The microwave medium material has low dielectric constant (6-8), the high quality factor (is greater than or equal to 45000), the sintering temperature is 920 DEG C, the process is simple, and the microwave medium material has the advantages of easy industrial production and stable material performance.

Description

technical field [0001] The invention belongs to the field of electronic ceramics and its manufacture, and relates to a low-dielectric and high-quality factor LTCC microwave dielectric material and a preparation method thereof. Background technique [0002] LTCC is an eye-catching multi-disciplinary integrated component technology. Because of its excellent electronic and thermo-mechanical properties, it has become the preferred way to integrate and modularize electronic components. It uses thick film materials, and according to the first designed structure, the electrode materials, substrates, electronic devices, etc. are fired at one time. It is an electronic packaging technology used to achieve high integration and high performance. As far as the current situation at home and abroad is concerned, LTCC has been well developed and applied. However, with the increasing development of communication equipment such as mobile communication, wireless local area network, and milita...

AI Technical Summary

Problems solved by technology

However, conventional solid-state sintering into magnesia-alumina spinel is accompanied by a volume expansion of 5% to 8%, and the ability of aggregation and recrystallization of magnesia-alumina spinel is very weak, so a high firing temperature is required, generally at 1600- Between 1700℃

To achieve complete sintering of magnesium aluminum spinel, higher sintering temperature is required, but its sintering temperature is high, and it is difficult to co-fire with low melting point electrode materials such as Cu and Ag.

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