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Flexible substrate structure and preparation method thereof

A technology for flexible substrates and rigid substrates, which is applied in the preparation of flexible display devices, flexible substrate structures and their preparation fields, can solve the problems of flexible materials falling off and cannot be removed from the mold, and achieves the effect of ideal adhesion.

Active Publication Date: 2017-11-10
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the flexible material is usually directly coated on the rigid substrate, which has a strong adhesive force, but there will be a problem that it cannot be removed from the type; or an inorganic layer is coated between the flexible material and the rigid substrate, so that Do reduce adhesion but increase the risk of flexible materials detaching from rigid substrate surfaces

Method used

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  • Flexible substrate structure and preparation method thereof
  • Flexible substrate structure and preparation method thereof
  • Flexible substrate structure and preparation method thereof

Examples

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Embodiment 1

[0050] Such as figure 1 As shown, this embodiment discloses a flexible substrate structure 100, including a rigid substrate 10 and a flexible substrate 20 disposed on the rigid substrate 10, and may also include:

[0051] A plurality of island structures 30 are discretely distributed on the upper surface of the rigid substrate 10, and the flexible substrate 20 covers the upper surface and side walls of the plurality of island structures 30 and the exposed upper surface of the rigid substrate 10;

[0052] The adhesive force per unit area between the flexible substrate 20 and the rigid substrate 10 is different from the adhesive force per unit area between the flexible substrate 20 and the island structure 30 .

[0053] In the above technical solution, since there are discretely distributed island structures 30 between the rigid substrate 10 and the flexible substrate 20, and the adhesive force per unit area between the flexible substrate 20 and the rigid substrate 10 is differe...

Embodiment 2

[0057] Such as figure 2 As shown, it also includes a method for preparing a flexible substrate structure, and the structure formed in each preparation step can be as follows Figure 3-5 As shown in the structure, the preparation method may include:

[0058] providing a rigid substrate 10;

[0059] Prepare an intermediate layer 31 on the rigid substrate 10;

[0060] After preparing a patterned photoresist layer 40 on the intermediate layer 31, the exposed intermediate layer 31 is etched, so as to form a pattern on the upper surface of the rigid substrate 10 such as Figure 4 The plurality of discretely distributed island structures 30 shown;

[0061] removing the photoresist layer 40;

[0062] A flexible substrate 20 is covered on the upper surface and side walls of the island structure 30 and the exposed upper surface of the rigid substrate 10 to form Figure 5 structure shown. Wherein, the adhesive force per unit area between the flexible substrate 20 and the rigid sub...

Embodiment 3

[0070] Such as Figure 6 Shown, also includes a kind of preparation method of flexible display device, this preparation method may comprise:

[0071] providing a rigid substrate 10;

[0072] Prepare an intermediate layer 31 on the rigid substrate 10;

[0073] Prepare a patterned photoresist layer 40 on the intermediate layer 31 and then etch the exposed intermediate layer 31 to prepare and form a plurality of discretely distributed island structures 30 on the upper surface of the rigid substrate 10;

[0074] removing the photoresist layer 40;

[0075] Covering a flexible substrate 20 on the upper surface and side walls of the island structure 30 and the exposed upper surface of the rigid substrate to obtain a flexible substrate structure 100;

[0076] Executing a predetermined process combination on the flexible substrate structure 100 to form a composite structure having a thin film transistor device structure and an organic light emitting diode device structure;

[0077]...

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Abstract

The invention discloses a flexible substrate structure, a preparation method of the flexible substrate structure, and a preparation method of a flexible display device. A rigid substrate is provided, a plurality of island structures subjected to discrete distribution are prepared on an upper surface of the rigid substrate, a flexible substrate covers the upper surfaces and side walls of the island structures and the exposed upper surface of the rigid substrate, and the adhesive force of a unit area between the flexible substrate and the rigid substrate is different from the adhesive force of the unit area between the flexible substrate and the island structures; a preparation process of a thin film transistor device structure and an organic light emitting diode device structure is further performed on the basis of the flexible substrate structure to form the flexible display device; and the contact areas of the flexible substrate with the rigid substrate and the island structures can be controlled easily so as to control the total adhesive force of the flexible substrate with the rigid substrate and the island structures, and thus the flexible substrate structure with an ideal adhesive force is prepared.

Description

technical field [0001] The present invention relates to the technical field of flexible display devices, in particular to a flexible substrate structure and a preparation method thereof, and a preparation method of a flexible display device. Background technique [0002] Due to its feature of being bendable, the flexible display device has greatly expanded the application range of mobile terminal products, and has become the most concerned display device product currently. Existing flexible display devices are usually implemented by organic light-emitting devices (OLED, Organic Light-Emitting Diode). [0003] At present, in the process of realizing flexible display devices through organic light-emitting devices, a flexible substrate will be adhered to a rigid substrate first, and then a series of processes will be performed on the flexible substrate, including but not limited to thin film transistor technology, organic Light-emitting diode technology, packaging technology. ...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/56
CPCH10K59/00H10K77/111Y02E10/549
Inventor 鲁佳浩亢澎涛潘新叶
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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