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Surface grinding device and planetary wheel

A technology of plane grinding and star wheel, which is applied in the field of star wheel, can solve the problems of inability to measure thickness and poor working efficiency, and achieve the effect of preventing deformation and damage, reducing working hours, and realizing the effect of grinding and processing.

Active Publication Date: 2020-06-26
SPEEDFAM CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially in the case of metal planetary wheels, since the laser light does not pass through, the thickness cannot be measured based on the laser light
Therefore, in the case of using a metal planetary wheel to grind a workpiece, it is necessary to take out the planetary wheel from the grinding device and measure the thickness using a measuring device such as a micrometer when not grinding, and the work efficiency is poor.

Method used

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  • Surface grinding device and planetary wheel
  • Surface grinding device and planetary wheel
  • Surface grinding device and planetary wheel

Examples

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Embodiment Construction

[0039] One embodiment of the plane polishing device of the present invention will be described in detail below using the drawings. The surface grinding device 1 of the present embodiment is used to grind the front and back surfaces of a light-transmitting (light-transmitting) plate-shaped workpiece 40 such as a silicon wafer or a glass substrate. figure 1 As shown, there are an upper fixed plate 2, a lower fixed plate 3, a sun gear (sun gear) 4, and an internal gear (internal gear) 5, which are rotatably arranged on the body of the plane grinding device 1 around the axis L, and have Metal planetary gears 30 are placed on the lower fixed plate 3 at equal intervals and mesh with the sun gear 4 and the internal gear 5 . A workpiece holding hole 32 for holding the above-mentioned workpiece 40 is formed in the planetary wheel 30 .

[0040] In addition, the surface grinding device 1 has a first drive shaft 2a, a second drive shaft 3a, a third drive shaft 4a, and a fourth drive shaf...

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Abstract

The present invention provides a plane grinding device and a star wheel. Even if the star wheel is a star wheel without light transmission, the thickness of the star wheel can be measured by laser, and the The effort and time required to remove the planetary wheel from the grinding device when measuring the thickness of the aforementioned planetary wheel can be easily managed for the interval between the thickness of the workpiece and the thickness of the planetary wheel, and the man-hours for the operation can be reduced. A surface grinding device (1) for grinding a workpiece (40) held on a planetary wheel (30) has a thickness measuring device (X) for measuring the thickness of the workpiece and the planetary wheel, and the thickness measuring device is configured to face the above-mentioned The workpiece and the above-mentioned planet wheel are irradiated with laser light and the thickness is measured based on the reflected light from the front and back. The above-mentioned planet wheel has: a main body (31) having a workpiece holding hole (32) for holding the above-mentioned workpiece; The part (Y) has a measuring hole (34) and a light-transmitting member (35) embedded in the measuring hole.

Description

technical field [0001] The present invention relates to a surface grinding device for grinding the front and back surfaces of workpieces such as semiconductor wafers, and a carrier for holding the workpieces. Background technique [0002] A flat lapping device that grinds a plate-shaped workpiece such as a semiconductor wafer or a glass substrate generally has an upper surface plate and a lower surface plate that are rotatably arranged, and a planetary wheel that holds the workpiece. , and is configured to clamp the workpiece held on the planetary wheel by the upper fixed disk and the lower fixed disk, and grind the front and back surfaces of the workpiece by the upper fixed disk and the lower fixed disk. [0003] It is known that in such a flat grinding device, a workpiece having a high flatness can be obtained by terminating the grinding when the difference between the thickness of the workpiece and the thickness of the pinion wheel reaches a predetermined value. Therefor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/08B24B37/28B24B37/34B24B49/12
CPCB24B37/08B24B37/28B24B37/34B24B49/12H01L21/30625B24B37/04B24B7/228B24B7/24H01L21/304H01L21/67092H01L22/12
Inventor 井上裕介吉原秀明
Owner SPEEDFAM CO LTD
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