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Z-direction interconnection circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, which is applied in multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems affecting the reliability of sub-board bonding strength, difficulty in filling glue, and easy generation of air bubbles, so as to avoid damage to Insufficient bit space, reducing the difficulty of glue filling, and enhancing the effect of bonding strength

Active Publication Date: 2017-09-12
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to prevent the conductive medium from being squeezed and scattered, the prepreg of the intermediate receiving layer can generally only be used with low fluidity.
At the same time, when making POFV (plated on filled via, electroplating on hole) process, the outer layer of copper on the sub-board is thicker, resulting in large fluctuations in the areas with copper and copper-free areas on the sub-board, and the low-lying copper-free areas are filled with glue. Difficult, defects such as air bubbles and cavities are prone to occur during the lamination process, which will affect the bonding strength and reliability between sub-boards and other quality problems

Method used

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  • Z-direction interconnection circuit board and manufacturing method thereof
  • Z-direction interconnection circuit board and manufacturing method thereof
  • Z-direction interconnection circuit board and manufacturing method thereof

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Embodiment Construction

[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.

[0031] like figure 1 , Figure 5 , Image 6 and Figure 7 As shown, the manufacturing method of the Z-direction interconnection circuit board of the present invention comprises the following steps:

[0032] S100 , making sub-boards 100 , the number of sub-boards 100 is at least two, and the at least two sub-boards 100 are arranged sequentially from top to bottom. Wherein, each sub-board 100 produced is provided with a pad layer (attached to one side facing another adjacent sub-board 100). Figure 5 and Figure 7 padslayer1 , padslayer2 , padslay...

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Abstract

The invention discloses a Z-direction interconnection circuit board and a manufacturing method thereof. The manufacturing method of the Z-direction interconnection circuit board comprises the following steps: sub-boards are manufactured, wherein at least two sub-boards are sequentially arranged from top to bottom, a pad layer is arranged on a side, facing the other adjacent sub-board, of each sub-board, and pads conductive and corresponding to conductive through holes in the sub-board one by one are arranged on each pad layer; an insulating dielectric layer covering the pad layer is manufactured on at least one of the two adjacent sub-boards; receiving holes are manufactured in the insulating dielectric layer, wherein the receiving holes correspond to the conductive through holes in the sub-board one by one; the receiving holes are filled with conductive dielectrics; and all the sub-boards are laminated to form a mother board, wherein the pad on each sub-board is conductive to the pad on the other adjacent sub-board by the conductive dielectric. The manufacturing method provided by the invention can effectively reduce glue filling difficulty, reduce bubbles, holes and other defects generated in a lamination process, and ensure bonding strength between the adjacent sub-boards.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a Z-direction interconnection circuit board and a manufacturing method thereof. Background technique [0002] With the development and construction of the communication industry, high-level backplanes have been gradually applied. With the increase of various networked consumer products in the future, there will be requirements for greater capacity and higher speed of information transmission. The future 5G network construction will inevitably require a backplane that can carry more daughter boards, less signal loss, and higher reliability. The manufacturing technology of ultra-high-density and higher-layer backplane will be a development direction of the printed circuit industry in the future. [0003] The Via bond (hole connection) process is a Z-direction arbitrary interconnection technology between layers. It is to press the pre-fabricated sub-boards together...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0298H05K3/4614H05K3/4632H05K2203/061
Inventor 廉泽阳吴森李艳国陈蓓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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