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Electric control variable-curved-surface fluorescent membrane die-pressing method and apparatus

A fluorescent film and variable curved surface technology, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of rapidly changing the shape of the diaphragm surface, achieve the effects of improving production quality and yield, improving surface accuracy, and reducing production costs

Active Publication Date: 2017-09-01
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the deficiency that the existing fluorescent film molding method cannot quickly change the shape of the produced film surface, and provide an electronically controlled variable curved surface fluorescent film molding method and device

Method used

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  • Electric control variable-curved-surface fluorescent membrane die-pressing method and apparatus
  • Electric control variable-curved-surface fluorescent membrane die-pressing method and apparatus
  • Electric control variable-curved-surface fluorescent membrane die-pressing method and apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] The electronically controlled variable curved surface molding fluorescent diaphragm includes the following steps:

[0054] (1) Yellow powder YG-04 is used for phosphor, HM-6101 silica gel is used for optical colloid; 10g of YG-04 phosphor, 10g of HM6101 silica gel A glue, 10g of HM6101 silica gel B glue are taken with a mass balance, YG-04 phosphor, Stir HM6101 silica gel A glue and HM6101 silica gel B glue evenly, then vacuum defoam the stirred fluorescent glue to prepare fluorescent glue;

[0055] (2) The heating device preheats the upper die base 2 and the upper die 3, the preheating temperature is 70°C, and the preheating time is 30 minutes;

[0056] (3) Set the voltage of the adjustable voltage DC power supply 6 to 100V, and the direction is positive; if Figure 2a shown;

[0057] (4) Under the action of the forward voltage input by the adjustable voltage DC power supply 6, the piezoelectric material 7 is deformed, thereby driving the elastic deformation sheet 8 ...

Embodiment 2

[0065] Embodiment 2 is the same as Embodiment 1, except that steps (2), (4), (7), and (8) are as follows:

[0066] (2) The heating device preheats the upper die base 2 and the upper die 3, the preheating temperature is 90°C, and the preheating time is 20 minutes;

[0067] (4) Under the action of the reverse voltage input by the adjustable voltage DC power supply 6, the piezoelectric material 7 is deformed, thereby driving the elastically deformed sheet 8 to deform on a specific curved surface, forming a molded curved surface of the fluorescent film with an upwardly concave curved surface shape, Such as Figure 3b shown;

[0068] (7) The die base 2 drives the upper die 3 to move downward, and molds the uncured fluorescent glue. The upper die 3 closes with the elastic deformation sheet 8 and the dam 4. The heating device 1 will press the upper die 3 and the elastic deformation sheet Heat the fluorescent glue in the closed space formed by 8 and the dam 4 to 120°C, keep the temp...

Embodiment 3

[0071] Embodiment 3 is the same as Embodiment 1, except that steps (2), (7), and (8) are as follows:

[0072] (2) The heating device preheats the upper die base 2 and the upper die 3, the preheating temperature is 80°C, and the preheating time is 25 minutes;

[0073] (7) The die matrix 2 drives the upper die 3 to move downward, and molds the uncured fluorescent glue. The upper die 3 closes with the elastically deformable sheet 8 and the dam 4. The heating device 1 connects the upper die 3 with the elastically deformable sheet. Heat the fluorescent glue in the closed space formed by 8 and the dam 4 to 135°C, keep the temperature and hold the pressure for 15 minutes;

[0074] (8) The heating device 1 controls the temperature at 80°C, the upper die matrix 2 drives the upper die 3 to move upward, the upper die 3 is separated from the elastically deformed sheet 8 and the dam 4, and the molded and cured fluorescent film is taken out; A fluorescent diaphragm with a concave curved sh...

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Abstract

The invention discloses an electric control variable-curved-surface fluorescent membrane die-pressing method and apparatus. The apparatus comprises a heating apparatus (1), an upper pressing die substrate (2), an upper pressing die (3), a box dam (4), a lower pressing die substrate (5), a voltage-adjustable direct current power supply (6), a piezoelectric material (7), an elastic deformable slice (8) and a separation membrane (9). According to the die-pressing method based on the apparatus, by adjusting the voltage value and direction of the voltage-adjustable direct current power supply (6), the piezoelectric material (7) generates deformation of different degrees; and the elastic deformable slice (8) is deformed to form a fluorescent membrane die-pressing surface with different curved surface shapes so that the fluorescent membranes with different curved surfaces can be prepared. The apparatus is high in controllability; and the deviation values of the curved surface shapes of the produced membrane are detected, and the value and the direction of the input voltage can be adjusted according to the deviation values, so that the deviation values in fluorescent membrane production can be compensated rapidly, the production quality and yield of the fluorescent membrane can be improved, and small-batch, and multi-model membrane production efficiency is greatly improved.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a molding method and device for an electrically controlled variable curved surface fluorescent diaphragm. Background technique [0002] The traditional packaging process of white light LED is to mix the phosphor powder and colloid and then directly coat it on the LED chip. The shortcomings to be overcome, such as fast light decay, uneven spatial distribution of color temperature, obvious color drift, and difficulty in controlling the light quality, etc. In order to avoid the above-mentioned shortcomings, white LED remote phosphor packaging technology was proposed. Its technical feature is to separate the phosphor powder from the LED chip in space. Or on optical components such as lenses, which can effectively improve the quality of LED lighting, improve light efficiency, reduce attenuation and reduce color drift. [0003] Fluorescent film is a commonly used product in remote fluore...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L21/67
CPCH01L33/50H01L21/67011Y02P40/57
Inventor 李宗涛汤勇丁鑫锐林庆宏万珍平李家声
Owner SOUTH CHINA UNIV OF TECH
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