Heat dissipation device used for computer case

Abstract

The invention belongs to the field of computers, and particularly discloses a heat dissipation device used for a computer case. The device comprises a heat dissipation fan which is arranged in the case; the device is characterized in that wind collecting grooves are formed in the out wind portions of the heat dissipation fan, the wind collecting grooves are communicated with ventilating pipes, and heat dissipating mechanisms are arranged on the out wind portions of the ventilating pipes; the heat dissipation mechanisms comprise a plurality of heat dissipation units, rotation shafts are connected between the heat dissipation units, and a plurality of rotating blades are arranged on the rotation shafts in a coaxial mode; the heat dissipation units comprise heat conduction plates which can conduct heat quickly, wherein sliding grooves are formed in the heat conduction plates, rotation components which are used for heat dissipation are located in the sliding grooves in a matched mode, and the rotation components are arranged on the rotation shafts. According to the heat dissipation device used for the computer case, heating components of the case can be subjected to initial heat dissipation, secondary heat dissipation and three times heat dissipation, the heat dissipation efficiency of the heating components of the case is greatly improved, the heat dissipation effects are better, the energy consumption of heat dissipation of the case is greatly lowered, and the maintenance cost is lowered.

Description

technical field [0001] The invention belongs to the field of computers, and in particular relates to a computer structural component or configuration. Background technique [0002] With the development of science and technology, computers began to enter various enterprises and families, and played an important role in production and life. The electronic components of desktop computers are generally assembled in the computer case, and some components in the computer will generate a lot of heat during operation, which will affect the work of the components themselves and other components. [0003] The Chinese patent with the publication number CN103970229A discloses a circumferential positive pressure cooling computer case, which includes a casing, an air intake box, and a cooling fan; Through holes corresponding to heating computer accessories are processed on the side, and the cooling fan is assembled inside the air intake box. The chassis blows cooling air to the air inta...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a heat dissipation device for computer case, to solve the problem of slow heat dissipation and poor heat dissipation effect of computer heating components in the background technology

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