A method for testing the electromigration of butt joints with consistent grain orientation

Abstract

The invention relates to an electromigration test method for a butt joint with consistent grain orientation, and belongs to the field of material preparation and connection. The method comprises the steps that brazing filler metal solder paste is adopted between two bonding pads to be subject to re-fusion welding so as to form a brazing filler metal joint, the brazing filler metal butt joint adheres to a base plate by adopting epoxy resin, at least one side surface of the brazing filler metal joint serves as the cross section of the brazing filler metal butt joint, and the brazing filler metal butt joint which shows single grain orientation under PLM is selected; the monocrystal butt joint is subjected to linear cutting and fine polishing, EBSD data are acquired, the included angle between the crystal grain C axis of the brazing filler metal butt joint and the current direction is determined, the brazing filler metal butt joint adheres to the base plate through the epoxy resin, and relevant test is carried out; and on the premise that the included angle between the crystal grain C axis of a monocrystal welding spot and the current direction is consistent, the reliability evaluation of the welding spot with the comparability is obtained.

Description

technical field [0001] The invention relates to an electromigration test method for a butt joint with consistent grain orientation, which belongs to the field of material preparation and connection, is suitable for preparing micro-brazed butt joints with consistent grain orientation, and is applied to electromigration reliability research. The method can effectively ensure the consistency of the size and grain orientation of the micro-butt joints, thereby ensuring the comparability of the electromigration reliability test data of the brazed butt joints. Background technique [0002] Solder joints are an integral part of microelectronic interconnection, playing the role of mechanical connection and electrical signal transmission. At present, the microelectronic packaging space is reduced, and the heat generation of the chip is intensified. On the one hand, the intermetallic compounds (Intermetallic Compounds, IMCs) generated by the reaction between the solder and the pad meta...

AI Technical Summary

Problems solved by technology

At present, it is a thermodynamic problem to deeply understand and predict the growth mode of Sn dendrites. After the interconnection is completed, each solder joint has a unique crystal orientation, so it is inevitable that there will be some solder joints due to the growth of β-Sn grains. Unfavorable orientation, premature failure during the use of electronic products, thereby reducing the service life of electronic products

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