Semiconductor circuit arrangement and assembly method with pressurized gel

Abstract

The present invention relates to a semiconductor circuit arrangement and more particularly to a semiconductor circuit arrangement comprising a power semiconductor module. Furthermore, the present invention relates to a method for assembling such a semiconductor circuit arrangement. A semiconductor circuit assembly (100) includes a semiconductor module (102) with at least one electronic component arranged on a first surface of a first circuit carrier, a base plate which is in contact with a second surface of the first circuit carrier, and a housing (110) with a lid (112), the housing (110) being arranged to cover the semiconductor module on the base plate (107). The semiconductor module (102) is at least partially coated with an electrically insulating compressed material (118) covering the at least one electronic component (104), wherein the lid (112) is arranged to impose mechanical pressure on the compressed material (118) in a direction toward said base plate (107).

Description

technical field [0001] The invention relates to semiconductor circuit arrangements and, in particular, to semiconductor circuit arrangements comprising power semiconductor modules. It has to be noted that the principles of the invention can also be applied to packaging any other kind of semiconductor circuits. Furthermore, the invention relates to a method of assembling such a semiconductor circuit arrangement. Background technique [0002] Power semiconductors have become an essential part of every aspect of everyday life. Power semiconductors enable, inter alia, variable speed actuators in consumer goods, industry and transport technology or are part of inverters and rectifiers in the power supply sector. [0003] A problem common to all power semiconductor modules is the relatively high temperature that occurs during operation. Therefore, good thermal contact between the semiconductor power devices and the heat sink for dissipating excess heat is essential for all powe...

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Problems solved by technology

[0011] also, Figure 6 to Figure 9 The known solution shown in has an additional disadvantage: the DCB substrate 206 is under mechanical tension which may cause cracking of the material unless the bend dimensions, bending tool, bending process and material type and layer thickness of the thermal interface material are strictly controlled

[0017] Firstly, this arrangement has the disadvantage that the plastic cover 411 covers parts of the printed circuit board 403, making it impossible to assemble components at these locations

In addition, this package configuration cannot use a hard thermal interface material, such as a phase change material, because the DCB 406 is mechanically weakened due to the opening therein and may crack during the assembly process.

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