Stamping die and stamping method using same
A technology of stamping dies and modules, which is applied in processing equipment and processing fields, can solve problems such as parts deformation, and achieve the effects of avoiding plate deformation, ensuring stamping quality, and avoiding deformation
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0030] The stamping die disclosed by the present invention has an upper die 1 and a lower die 4. The upper die 1 is provided with a plurality of upper modules, and the lower die 4 is correspondingly provided with a plurality of lower modules. Group, the module performs stamping action on the plate. The module composed of upper and lower modules will be described in detail below. It should be noted that in this manual, unless otherwise specified, a module refers to a set of structures composed of corresponding upper modules and lower modu...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com