Full ceramic adhesive bonding packaging technology applied to crystal resonator

A crystal resonator and packaging process technology, applied in electrical components, impedance networks, etc., can solve problems such as high production costs, increased supply risks, shortages, etc., to achieve high air tightness, avoid high production costs, adhesive good effect

Inactive Publication Date: 2017-06-27
HUBEI TKD ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of ceramic base requires high technology and special high-temperature and high-strength equipment for production, relatively high production costs, and has always been out of stock in terms of supply
Strictly speaking, this type of ceramic base is currently monopolized and controlled by three Japanese companies worldwide, which increases the risk of supply

Method used

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  • Full ceramic adhesive bonding packaging technology applied to crystal resonator
  • Full ceramic adhesive bonding packaging technology applied to crystal resonator
  • Full ceramic adhesive bonding packaging technology applied to crystal resonator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] An all-ceramic adhesive bonding packaging process applied to crystal resonators, characterized in that it comprises the following steps:

[0021] 1) Production of ceramic base: select blank ceramic sheets, use a laser drilling machine to punch holes in the ceramic sheets line by line, grind the ceramic sheets with micro-through holes, and clean the holes left on the back of the ceramic sheets after laser slag, and ultrasonically clean and dry the ceramic sheet, pour conductive paste into the micro through hole of the ceramic sheet, put it in an oven to solidify, and form an electronic circuit channel, and then use screen printing to print the circuit on the front and back of the ceramic sheet , and sintered in 5 temperature zones in the sintering furnace to form metal dispensing pads and metal pads, and finally use a laser slicer to scribe the circuitized ceramic sheets, and divide the large electric polarized ceramic sheets into Small pieces, washed and dried to obtain...

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PUM

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Abstract

The invention discloses a full-ceramic glue-bonded packaging process applied to crystal resonators. The full-ceramic glue-bonded package technology adopted in the process effectively avoids the application of high-cost equipment and control technology, and provides a manufacturing Process method for low cost, effective and durable quartz crystal resonator.

Description

technical field [0001] The invention relates to the field of preparation of crystal resonators, in particular to an all-ceramic adhesive bonding packaging process applied to crystal resonators. Background technique [0002] Due to its frequency accuracy and stability, quartz crystal resonators are an indispensable part in modern electronic industries such as computers, entertainment, communications and other equipment and other fields we are involved in. So far, quartz crystal resonators are usually made of quartz wafers sealed by some method, and DC voltage is applied to the leads of the sealed package to cause mechanical vibration of the quartz crystal resonator. [0003] Typically, surface mount quartz crystal resonators consist of a quartz wafer, a ceramic base, and a metal cover. In order to achieve a fully sealed working environment, the pressure-welded package of this type of ceramic base and metal cover requires special equipment, and this type of equipment is mainl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02
CPCH03H3/02
Inventor 喻信东
Owner HUBEI TKD ELECTRONICS TECH
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