Metallic packaging structure chip tantalum capacitor and packaging method thereof

Abstract

The present invention provides a metallic packaging structure chip tantalum capacitor and a packaging method thereof. A metallic packaging structure is employed, a tantalum chip is coated with one layer of cohesive conductive adhesive, the cohesive conductive adhesive is coated with one layer of a metal case; and one end of the tantalum chip is connected with a tantalum wire, the tantalum wire is led out of the metal case through a tantalum outgoing line to form a metallic packaging structure chip tantalum capacitor. The tantalum wire and the tantalum outgoing line are connected through welding, and a welding point of the tantalum wire and the tantalum outgoing line is located at the inner surface of the metal case, the welding point of the tantalum wire and the tantalum outgoing line is coated with an insulation block, the position between the insulation block and the tantalum chip and the outer portion of the insulation block are both coated with the cohesive conductive adhesive to allow the spaces between tantalum chip and the tantalum wire and the tantalum wire outgoing line and the case to be relatively fixed.

Description

technical field [0001] The invention relates to an electronic component and a manufacturing method thereof, in particular to a chip tantalum capacitor with a metal package structure and a manufacturing method thereof, so as to solve the problem of airtightness of resin packaged products, improve its reliability, and maintain a chip appearance at the same time Designed for ease of installation and use. It belongs to the technical field of making electronic components. [0002] Background technique: [0003] Chip solid tantalum capacitor is a polar component. In microelectronic circuits, the unidirectional conductivity of its dielectric layer can be used for filtering to filter out or reduce the amplitude of the remaining AC ripple signal in the DC signal. , The chip solid tantalum capacitor is characterized by long life, high temperature resistance, high accuracy, excellent high-frequency harmonic filtering performance, and various forms, excellent volume efficiency, has its ...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to propose a new chip solid tantalum capacitor and its manufacturing method in view of the shortcomings of the existing chip solid tantalum capacitor resin packaging method. The chip solid tantalum capacitor and its manufacturing method can effectively solve the problem of Type solid tantalum capacitors are vulnerable to the intrusion of moisture or corrosive gases and liquids in harsh environments such as high temperature and high humidity, and damage the internal conduction lines and cores of the device, resulting in deterioration of product performance or even failure.