Acoustic fingerprint identification device, method for making the same, and electronic device using the same
A fingerprint recognition and sound wave technology, which is applied in the field of sound wave fingerprint recognition devices, can solve problems such as adverse effects of sensing, and achieve the effects of saving materials and processes, reducing the number of material layers, and accurate sensing results
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0037] Such as figure 1 and figure 2 As shown, the acoustic wave fingerprint identification device 100 according to the first embodiment of the present invention includes a cover plate 140 , a circuit substrate 130 , a signal transmission unit 120 , and an ultrasonic sensing unit 110 .
[0038] The circuit substrate 130 is fixed on one side of the cover plate 140, the ultrasonic sensing unit 110 is arranged on the side of the circuit substrate 130 away from the cover plate 140, one end of the signal transmission unit 120 is connected to a control device (not shown), and the other end is simultaneously connected to The ultrasonic sensing unit 110 and the circuit substrate 130 are used to realize signal transmission between the control device and the ultrasonic sensing unit 110 and the circuit substrate 130 .
[0039] The cover plate 140 includes a cover glass 142 and a first adhesive layer 141 , and the cover glass 142 is combined with the circuit substrate 130 through the fi...
no. 2 example
[0057] Such as Figure 4 and Figure 5 As shown, the acoustic wave fingerprint identification device 200 according to the second embodiment of the present invention includes a cover plate 240 , a circuit substrate 230 , an ultrasonic sensing unit 210 , and a signal transmission unit 220 .
[0058] The circuit substrate 230 is fixed on one side of the cover plate 240, the ultrasonic sensing unit 210 is arranged on the side of the circuit substrate 230 away from the cover plate 240, one end of the signal transmission unit 220 is connected to a control device (not shown), and the other end is simultaneously connected to The ultrasonic sensing unit 210 and the circuit substrate 230 are used to realize signal transmission between the control device and the ultrasonic sensing unit 210 and the circuit substrate 230 .
[0059] The cover plate 240 includes a cover glass 242 and a first adhesive layer 241 , and the cover glass 242 is combined with the circuit substrate 230 through the ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com