Numerical method for rapidly predicting interconnection transmission characteristics of coupled through glass via

Abstract

The invention discloses a numerical method for rapidly predicting interconnection transmission characteristics of a coupled through glass via (TGV), rapidly and effectively calculates the interconnection transmission characteristics of the coupled TGV by virtue of MATLAB (matrix laboratory) numerical software, analyzes influences of design parameters such as a bottom via radius and a top via radius of the through glass via, a through via height, a via distance between the vias and a substrate conductivity on the transmission characteristics of the coupled TGV, overcomes the defects of long simulation time and low execution efficiency of existing HFSS (High Frequency Structure Simulator) electromagnetic simulation software and HSPICE (High Simulation Program with Integrated Circuit Emphasis) circuit simulation software and improves the design efficiency of a three-dimensional integrated circuit. In the method, when the interconnection transmission characteristics of the TGV are predicted, the coupled noise between the TGVs is considered, the interconnection transmission characteristics of the TGV in a TGV signal transmission mode of SGS (Signal-Ground-Signal) and GSSG (Ground-Signal-Signal-Ground) types can be calculated rapidly and accurately under the requirement of consideration of the TGV coupling effect; and the problems that only the interconnection transmission characteristics of a single signal TGV are analyzed in the existing analytical technology but the influence of an adjacent signal through via on the interconnection transmission quality of a target signal TGV is not considered are solved.

Description

technical field [0001] The invention belongs to the field of electronic technology, and specifically relates to a numerical method for quickly predicting the interconnection transmission characteristics of coupling through-glass vias, which can be used in the front-end design of three-dimensional integrated circuits, and quickly predicts the interconnection transmission characteristics of through-glass vias under coupling crosstalk effects. Background technique [0002] Through Glass Via (Through Glass Via, TGV for short) technology is an effective strategy for realizing 2.5D and 3D integrated packaging systems. TGV is formed by drilling through holes in the glass substrate by etching or laser melting, and then electroplating and filling metal copper or tungsten in the through holes. However, due to the limitation of the hole opening process, the drilled through hole is tapered, and the size of the through hole is generally larger than the standard logic cell. For example, u...

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Problems solved by technology

[0006] The common deficiency of the two methods disclosed in the above two papers is that only the analysis of the interconnection and transmission characteristics of the vias in the signal-ground (SG) via structure and the ground-signal-ground (GSG) via structure is not carried out. Consider the coupling effect of adjacent signal vias to target signal vias

In the actual signal-ground-signal (SGS) and ground-signal-signal-ground (GSSG) type TGV signal transmission modes, the coupling effect between vias is inevitable, which may lead to an increase in the bit error rate of high-speed signal transmission and a decrease in Signal transmission quality, there is a certain error between the transmission characteristics of the signal vias obtained by using the calculation methods in the above two papers and the transmission characteristics of the actual coupling vias

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