Liquid metal three-dimensional circuit and its manufacturing method based on 3D printing technology

Abstract

The invention relates to a method for manufacturing a liquid metal three-dimensional circuit based on a 3D printing process, comprising the following steps: S1: establishing a three-dimensional model corresponding to the three-dimensional structure of the three-dimensional circuit to be manufactured, and according to the line direction of the three-dimensional circuit in the A hollow flow channel is built inside the three-dimensional model; S2: Print the three-dimensional model obtained in step S1 into a three-dimensional solid through a 3D printing process; S3: Fill the hollow flow channel of the three-dimensional solid with liquid metal. The manufacturing method provided by the invention can not only greatly reduce the manufacturing cost of the three-dimensional circuit, but also simplify the installation and manufacturing process, and realize the free, fast and economical individualized design and manufacture of the three-dimensional circuit under normal temperature and pressure. It has great advantages in making full use of liquid metal and 3D printing manufacturing technology and developing new flexible three-dimensional circuit preparation technology.

Description

technical field [0001] The invention relates to the field of electronic circuit manufacturing, in particular to a liquid metal three-dimensional circuit based on a 3D printing process and a manufacturing method thereof. Background technique [0002] With the rapid development of the electronic information industry, the electronic circuit as the basis of the electronic information industry is entering into flexible electronics (Flexible Electronics) that can withstand large deformations such as stretching, compression, and bending, and electronic components directly mounted on the surface of a three-dimensional plastic carrier. The three-dimensional circuit (Three-dimensional Molded Interconnect Devices: three-dimensional molded interconnect devices) is a new era of development. Such stretchable and bendable flexible electronic devices and three-dimensional circuits with free design and complex structure have very broad and good application prospects in solar cells, dynamic s...

AI Technical Summary

Problems solved by technology

Due to the need to use special materials to prepare a three-dimensional structure carrier, and electroplating or electroless plating is required, the manufacturing cost is high; the injection molding of the carrier and the generation of circuit patterns require special molds and equipment and strict environmental conditions, high energy consumption and equipment cost and maintenance costs are high; in addition, the laser activation and metal plating process will affect the accuracy of the circuit, resulting in a low pass rate of the product

[0006] Whether it is the "subtractive method" or the "additive method", there are certain defects in equipment investment, material selection, energy conservation and environmental protection, etc., and it is impossible to achieve low cost, easy operation, and flexibility under normal temperature and normal pressure environmental conditions. Personalized circuit customization of circuit and three-dimensional circuit features

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