3D printing technology based liquid metal stereoscopic circuit and manufacture method thereof

Abstract

The invention relates to a 3D printing technology based liquid metal stereoscopic circuit manufacture method. The method includes steps of S1, establishing a three-dimensional model corresponding to a three-dimensional structure of a to-be-manufactured stereoscopic circuit and establishing hollow runners in the three-dimensional model according to line routes of the stereoscopic circuit; S2, printing the three-dimensional model obtained in S1 into a three-dimensional solid body through the 3D printing technology; S3, filling the hollow runners of the three-dimensional solid body with liquid metal. By adopting the manufacture method provided by the invention, the manufacture cost of the stereoscopic circuit can be reduced substantially and installation and manufacture processes can be simplified. Free, quick and economical customized design and manufacture of the stereoscopic circuit can be realized in normal temperature and normal pressure. The invention has great advantages in full utilization of liquid metal and the 3D printing manufacture technology and the development of a novel flexible stereoscopic circuit preparation technology.

Description

technical field [0001] The invention relates to the field of electronic circuit manufacturing, in particular to a liquid metal three-dimensional circuit based on a 3D printing process and a manufacturing method thereof. Background technique [0002] With the rapid development of the electronic information industry, the electronic circuit as the basis of the electronic information industry is entering the field of flexible electronics (Flexible Electronics) that can withstand large deformations such as stretching, compression, and bending, and electronic components directly mounted on the surface of three-dimensional plastic carriers. A new era in which three-dimensional molded interconnect devices (Three-dimensional Molded Interconnect Devices: three-dimensional molded interconnect devices) is the main body of development. Such stretchable and bendable flexible electronic devices and three-dimensional circuits with free design and complex structure have very broad and good a...

AI Technical Summary

Problems solved by technology

Due to the need to use special materials to prepare a three-dimensional structure carrier, and electroplating or electroless plating is required, the manufacturing cost is high; the injection molding of the carrier and the generation of circuit patterns require special molds and equipment and strict environmental conditions, high energy consumption and equipment cost and maintenance costs are high; in addition, the laser activation and metal plating process will affect the accuracy of the circuit, resulting in a low pass rate of the product

[0006] Whether it is the "subtractive method" or the "additive method", there are certain defects in equipment investment, material selection, energy conservation and environmental protection, etc., and it is impossible to achieve low cost, easy operation, and flexibility under normal temperature and normal pressure environmental conditions. Personalized circuit customization of circuit and three-dimensional circuit features

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