Forming method of overlapping structure of housing of electronic product

A laminated structure and electronic product technology, applied in the field of electronic product manufacturing, can solve the problems of complex surface treatment process of composite materials, difficult adhesion of ordinary coatings, unfavorable promotion and use, etc., to shorten the production cycle, save processing time, and reduce surface treatment costs Effect

Inactive Publication Date: 2017-06-09
HEZHOU SITONG INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, this kind of composite material generally has many flaws and problems on the product surface after the surface treatment process is formed. Bridging paint is used to ensure that the paint is closely attached to the composite material, which leads to complex surface treatment process and high cost of the composite material, which is not conducive to its popularization and use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] A method for forming a laminated structure of an electronic product housing, comprising the steps of:

[0051] Step 1. Soak the carbon fiber cloth with a thermosetting resin for 3 hours. The mass volume ratio of the carbon fiber cloth to the thermosetting resin is 1:5. Take the glass fiber cloth and soak it with a thermoplastic resin for 3 to 9 hours. The glass fiber cloth and the thermosetting resin are soaked for 3 to 9 hours. The mass volume ratio of the thermoplastic resin is 1:4;

[0052] Step 2. For the carbon fiber cloth and glass fiber cloth treated in step 1, take 2 layers of carbon fiber cloth and 1 layer of glass fiber cloth, and stack them sequentially to a certain height to obtain a composite material stack; the certain height It is 1cm.

[0053]Step 3. At least one layer of plastic layer is provided on the upper surface of the composite material stack. The surface of the at least one layer of plastic layer has images, and the images on the at least one la...

Embodiment 2

[0057] A method for forming a laminated structure of an electronic product housing, comprising the steps of:

[0058] Step 1. Take carbon fiber cloth and soak it in thermosetting resin for 3 to 7 hours. The mass volume ratio of the carbon fiber cloth to the thermosetting resin is 1:5 to 6. Take the glass fiber cloth and soak it in thermoplastic resin for 3 to 9 hours. The mass volume ratio of the glass fiber cloth to the thermoplastic resin is 1:4~6;

[0059] Step 2. For the carbon fiber cloth and glass fiber cloth treated in step 1, take 2 to 4 layers of carbon fiber cloth and 1 layer of glass fiber cloth, and stack them sequentially to a certain height to obtain a composite material stack; the certain The height is 1-5cm.

[0060] Step 3, setting at least one layer of plastic layer on the upper surface of the composite material stack, the surface of the at least one layer of plastic layer forms a complete pattern, and the thickness of each layer of plastic layer is 50 μm; t...

Embodiment 3

[0064] A method for forming a laminated structure of an electronic product housing, comprising the steps of:

[0065] Step 1. Take the carbon fiber cloth and soak it in a thermosetting resin for 5 hours. The mass volume ratio of the carbon fiber cloth to the thermosetting resin is 1:5.5. Take the glass fiber cloth and soak it in a thermoplastic resin for 6 hours. The glass fiber cloth and the The mass volume ratio of thermoplastic resin is 1:5;

[0066] Step 2. For the carbon fiber cloth and glass fiber cloth treated in step 1, take 3 layers of carbon fiber cloth and 1 layer of glass fiber cloth, and stack them sequentially to a certain height to obtain a composite material stack; the certain height It is 3cm.

[0067] Step 3. Two layers of plastic layers are arranged on the upper surface of the composite material stack. The surfaces of the two layers of plastic layers all have images, and the images on the two layers of plastic layers together form a complete pattern. Each l...

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Abstract

The invention discloses a molding method for a laminated structure of an electronic product casing, comprising: step 1, taking carbon fiber cloth and soaking it in thermosetting resin for 3-7 hours, taking glass fiber cloth and soaking it in thermoplastic resin for 3-9 hours; step 2, taking 2 ~ 4 layers of carbon fiber cloth and 1 layer of glass fiber cloth are stacked alternately until a certain height is reached to obtain a composite material stack; step 3, at least one plastic layer is arranged on the upper surface of the composite material stack, the at least one Each plastic layer has an image on its surface, and the images on the at least one plastic layer together form a complete pattern, and the thickness of each plastic layer is 20 μm to 50 μm; step 4, placing the composite material above in a mold In this process, the mold is pressurized and heated so that the plastic layer and the composite material are laminated and fused, and then the mold temperature is rapidly lowered to form a laminated shell structure, and the pressure of the mold is 2 to 4×10 5 Pa, the heating temperature is 190-250°C.

Description

technical field [0001] The invention belongs to the technical field of electronic product manufacturing methods, and relates to a forming method of a laminated structure of an electronic product shell. Background technique [0002] Electronic products such as mobile phones, tablet computers, personal computers, etc. are in a period of rapid updating, and various new technologies and new applications are emerging one after another, and there are higher requirements for the casing of electronic products. The material of the traditional electronic product casing is generally metal or plastic. The metal shell is heavy, while the plastic shell is more brittle and generally thicker. With the development of the electronic product industry, light and thin products are more and more popular. Therefore, the use strength is higher and can be made Thinner composite materials are used to make electronic product casings, which has become the choice of many manufacturers and individual us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C70/34
CPCB29C70/345
Inventor 欧阳丽娟陈柏凤
Owner HEZHOU SITONG INFORMATION TECH CO LTD
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